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Khodabakhshi, F., Zareghomsheh, M., Khatibi, G. (2020) Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes. Materials Science and Engineering: A, 797. 140203pp. doi:10.1016/j.msea.2020.140203

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Reference TypeJournal (article/letter/editorial)
TitleNanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes
JournalMaterials Science and Engineering: A
AuthorsKhodabakhshi, F.Author
Zareghomsheh, M.Author
Khatibi, G.Author
Year2020 (October)Volume797
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2020.140203Search in ResearchGate
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Mindat Ref. ID13503592Long-form Identifiermindat:1:5:13503592:6
GUID0
Full ReferenceKhodabakhshi, F., Zareghomsheh, M., Khatibi, G. (2020) Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes. Materials Science and Engineering: A, 797. 140203pp. doi:10.1016/j.msea.2020.140203
Plain TextKhodabakhshi, F., Zareghomsheh, M., Khatibi, G. (2020) Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes. Materials Science and Engineering: A, 797. 140203pp. doi:10.1016/j.msea.2020.140203
In(2020) Materials Science and Engineering: A Vol. 797. Elsevier BV

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Liu, C.Z., Chen, J. (2007) Nanoindentation of lead-free solders in microelectronic packaging. Materials Science and Engineering: A, 448. 340-344 doi:10.1016/j.msea.2006.10.056
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Khodabakhshi, F., Gerlich, A.P., Verma, D., Nosko, M., Haghshenas, M. (2021) Small-scale plasticity of ultra-fine grained alloy and nanostructured nanocomposite: Ambient and elevated-temperature nanoindentation. Materials Science and Engineering: A, 807. 140873pp. doi:10.1016/j.msea.2021.140873
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Gao, F., Takemoto, T. (2006) Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation. Materials Letters, 60. 2315-2318 doi:10.1016/j.matlet.2005.12.132
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El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders. Materials Science and Engineering: A, 608. 130-138 doi:10.1016/j.msea.2014.04.070
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