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Yu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012

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Reference TypeJournal (article/letter/editorial)
TitleImprovement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements
JournalJournal of Alloys and Compounds
AuthorsYu, D.QAuthor
Zhao, JAuthor
Wang, LAuthor
Year2004 (August)Volume376
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2004.01.012Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11884553Long-form Identifiermindat:1:5:11884553:5
GUID0
Full ReferenceYu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012
Plain TextYu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012
In(n.d.) Journal of Alloys and Compounds Vol. 376. Elsevier BV

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Zhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005
Yu, D.Q., Xie, H.P., Wang, L. (2004) Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. Journal of Alloys and Compounds, 385. 119-125 doi:10.1016/j.jallcom.2004.04.129
Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L. (2005) Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. Journal of Alloys and Compounds, 392. 192-199 doi:10.1016/j.jallcom.2004.09.023
Wang, L, Yu, D.Q, Zhao, J, Huang, M.L (2002) Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy. Materials Letters, 56. 1039-1042 doi:10.1016/s0167-577x(02)00672-9
Osório, Wislei R., Peixoto, Leandro C., Garcia, Leonardo R., Mangelinck-Noël, Nathalie, Garcia, Amauri (2013) Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys. Journal of Alloys and Compounds, 572. 97-106 doi:10.1016/j.jallcom.2013.03.234
Zhang, Q.K., Long, W.M., Yu, X.Q., Pei, Y.Y., Qiao, P.X. (2015) Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints. Journal of Alloys and Compounds, 622. 973-978 doi:10.1016/j.jallcom.2014.11.030
Duan, L.L., Yu, D.Q., Han, S.Q., Ma, H.T., Wang, L. (2004) Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170°C. Journal of Alloys and Compounds, 381. 202-207 doi:10.1016/j.jallcom.2004.03.124
Billah, Md. Muktadir, Shorowordi, Kazi Mohammad, Sharif, Ahmed (2014) Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties. Journal of Alloys and Compounds, 585. 32-39 doi:10.1016/j.jallcom.2013.09.131
Yu, D.Q., Wang, L. (2008) The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction. Journal of Alloys and Compounds, 458. 542-547 doi:10.1016/j.jallcom.2007.04.047
Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, Lai, Zhongmin (2011) Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition. Journal of Alloys and Compounds, 509. 7152-7161 doi:10.1016/j.jallcom.2011.04.037
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
 
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