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Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, Lai, Zhongmin (2011) Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition. Journal of Alloys and Compounds, 509. 7152-7161 doi:10.1016/j.jallcom.2011.04.037

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition
JournalJournal of Alloys and Compounds
AuthorsZeng, GuangAuthor
Xue, SongbaiAuthor
Gao, LiliAuthor
Zhang, LiangAuthor
Hu, YuhuaAuthor
Lai, ZhongminAuthor
Year2011 (June)Volume509
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2011.04.037Search in ResearchGate
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Mindat Ref. ID11898384Long-form Identifiermindat:1:5:11898384:8
GUID0
Full ReferenceZeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, Lai, Zhongmin (2011) Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition. Journal of Alloys and Compounds, 509. 7152-7161 doi:10.1016/j.jallcom.2011.04.037
Plain TextZeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, Lai, Zhongmin (2011) Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition. Journal of Alloys and Compounds, 509. 7152-7161 doi:10.1016/j.jallcom.2011.04.037
In(n.d.) Journal of Alloys and Compounds Vol. 509. Elsevier BV

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Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
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Wu, Jie, Xue, Songbai, Wang, Jingwen, Huang, Guoqiang (2019) Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences, 9. 3590pp. doi:10.3390/app9173590
Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun (2017) Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature. Transactions of the Indian Institute of Metals, 70. 2429-2439 doi:10.1007/s12666-017-1104-z
Yu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012
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