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Tian, Shuang, Li, Saipeng, Zhou, Jian, Xue, Feng (2018) Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. Journal of Alloys and Compounds, 742. 835-843 doi:10.1016/j.jallcom.2018.01.386

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Reference TypeJournal (article/letter/editorial)
TitleThermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy
JournalJournal of Alloys and Compounds
AuthorsTian, ShuangAuthor
Li, SaipengAuthor
Zhou, JianAuthor
Xue, FengAuthor
Year2018 (April)Volume742
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2018.01.386Search in ResearchGate
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Mindat Ref. ID11920210Long-form Identifiermindat:1:5:11920210:8
GUID0
Full ReferenceTian, Shuang, Li, Saipeng, Zhou, Jian, Xue, Feng (2018) Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. Journal of Alloys and Compounds, 742. 835-843 doi:10.1016/j.jallcom.2018.01.386
Plain TextTian, Shuang, Li, Saipeng, Zhou, Jian, Xue, Feng (2018) Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. Journal of Alloys and Compounds, 742. 835-843 doi:10.1016/j.jallcom.2018.01.386
In(n.d.) Journal of Alloys and Compounds Vol. 742. Elsevier BV

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Zhou, Jian, Huang, Dan, Fang, Yi-Li, Xue, Feng (2009) Investigation on properties of Sn–8Zn–3Bi lead-free solder by Nd addition. Journal of Alloys and Compounds, 480. 903-907 doi:10.1016/j.jallcom.2009.02.064
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