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Yu, Zhuhuan, Yang, Xiong, Qiang, Junfeng, Lv, Haiyan, Yang, Zi, Ma, Tianxiao, Shangguan, Xirui (2025) Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy. Journal of Alloys and Compounds, 1017. doi:10.1016/j.jallcom.2025.178985

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Reference TypeJournal (article/letter/editorial)
TitleEffects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy
JournalJournal of Alloys and Compounds
AuthorsYu, ZhuhuanAuthor
Yang, XiongAuthor
Qiang, JunfengAuthor
Lv, HaiyanAuthor
Yang, ZiAuthor
Ma, TianxiaoAuthor
Shangguan, XiruiAuthor
Year2025 (February)Volume1017
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2025.178985Search in ResearchGate
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Mindat Ref. ID18014725Long-form Identifiermindat:1:5:18014725:4
GUID0
Full ReferenceYu, Zhuhuan, Yang, Xiong, Qiang, Junfeng, Lv, Haiyan, Yang, Zi, Ma, Tianxiao, Shangguan, Xirui (2025) Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy. Journal of Alloys and Compounds, 1017. doi:10.1016/j.jallcom.2025.178985
Plain TextYu, Zhuhuan, Yang, Xiong, Qiang, Junfeng, Lv, Haiyan, Yang, Zi, Ma, Tianxiao, Shangguan, Xirui (2025) Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy. Journal of Alloys and Compounds, 1017. doi:10.1016/j.jallcom.2025.178985
In(2025) Journal of Alloys and Compounds Vol. 1017. Elsevier BV

References Listed

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See Also

These are possibly similar items as determined by title/reference text matching only.

Tian, Shuang, Li, Saipeng, Zhou, Jian, Xue, Feng (2018) Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. Journal of Alloys and Compounds, 742. 835-843 doi:10.1016/j.jallcom.2018.01.386
Lv, Xiaochun, Pan, Zhen, Liu, Yang, Zhang, Chenghao, Wang, Zhiyuan, Sun, Fenglian (2025) Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder. Metals, 15 (2). doi:10.3390/met15020157
Andersson, Cristina, Sun, Peng, Liu, Johan (2008) Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications. Journal of Alloys and Compounds, 457. 97-105 doi:10.1016/j.jallcom.2007.03.028
Kanlayasiri, Kannachai, Mongkolwongrojn, Mongkol, Ariga, Tadashi (2009) Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy. Journal of Alloys and Compounds, 485. 225-230 doi:10.1016/j.jallcom.2009.06.020
Li, Z.H., Tang, Y., Guo, Q.W., Li, G.Y. (2019) Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys. Journal of Alloys and Compounds, 789. 150-162 doi:10.1016/j.jallcom.2019.03.013
Wan, Jingbo, Liu, Yongchang, Wei, Chen, Gao, Zhiming (2008) Effect of the addition of In on the microstructural formation of Sn–Ag–Zn lead-free solder. Journal of Alloys and Compounds, 463. 230-237 doi:10.1016/j.jallcom.2007.09.070
Li, Xianfen, Zhang, Fei, Zu, Fangqiu, Lv, Xue, Zhao, Zhenxing, Yang, Dongdong (2010) Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder. Journal of Alloys and Compounds, 505. 472-475 doi:10.1016/j.jallcom.2010.06.087
Billah, Md. Muktadir, Shorowordi, Kazi Mohammad, Sharif, Ahmed (2014) Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties. Journal of Alloys and Compounds, 585. 32-39 doi:10.1016/j.jallcom.2013.09.131
El-Daly, A.A., Eid, N.A.M., Ibrahiem, A.A. (2022) Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder. Journal of Alloys and Compounds, 902. 163808pp. doi:10.1016/j.jallcom.2022.163808
Yu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012
Kumar, K. Mohan, Kripesh, V., Tay, Andrew A.O. (2008) Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy. Journal of Alloys and Compounds, 455. 148-158 doi:10.1016/j.jallcom.2007.01.045
 
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