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Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226

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Reference TypeJournal (article/letter/editorial)
TitleEffect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging
JournalJournal of Alloys and Compounds
AuthorsWu, JieAuthor
Xue, SongbaiAuthor
Wang, JingwenAuthor
Wu, MingfangAuthor
Year2019 (August)Volume799
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2019.05.226Search in ResearchGate
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Mindat Ref. ID11926360Long-form Identifiermindat:1:5:11926360:4
GUID0
Full ReferenceWu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
Plain TextWu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
In(n.d.) Journal of Alloys and Compounds Vol. 799. Elsevier BV

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Wu, Jie, Xue, Songbai, Wang, Jingwen, Huang, Guoqiang (2019) Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences, 9. 3590pp. doi:10.3390/app9173590
Wu, Jie, Xue, Songbai, Huang, Guoqiang, Sun, Huabin, Chi, Fengfeng, Yang, Xiaolei, Xu, Yong (2022) In-situ synergistic effect of Pr and Al2O3 nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint. Journal of Alloys and Compounds, 905. 164152pp. doi:10.1016/j.jallcom.2022.164152
Li, Z.H., Tang, Y., Guo, Q.W., Li, G.Y. (2020) A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints. Journal of Alloys and Compounds, 818. 152893pp. doi:10.1016/j.jallcom.2019.152893
Bo, Wang, Songbai, Xue, Jianxin, Wang, Weimin, Long, Qingke, Zhang (2018) Effect of Rare Earth Pr on Creep Behavior of Sn-0.3Ag-0.7Cu-0.5Ga Low-Ag Solder Alloys. Rare Metal Materials and Engineering, 47. 2657-2662 doi:10.1016/s1875-5372(18)30205-4
Tang, Y., Guo, Q.W., Luo, S.M., Li, Z.H., Li, G.Y., Hou, C.J., Zhong, Z.Y., Zhuang, J.J. (2019) Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process. Journal of Alloys and Compounds, 778. 741-755 doi:10.1016/j.jallcom.2018.11.156
Li, Z.H., Tang, Y., Guo, Q.W., Li, G.Y. (2019) Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys. Journal of Alloys and Compounds, 789. 150-162 doi:10.1016/j.jallcom.2019.03.013
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