Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research, 26 (12) 1468-1471 doi:10.1557/jmr.2011.179

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleFormation of interfacial η′-Cu6Sn5in Sn–0.7Cu/Cu solder joints during isothermal aging
JournalJournal of Materials Research
AuthorsLuo, ZhongbingAuthor
Wang, LaiAuthor
Fu, QinqinAuthor
Cheng, ChongqianAuthor
Zhao, JieAuthor
Year2011 (June 28)Volume26
Issue12
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2011.179Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID17102632Long-form Identifiermindat:1:5:17102632:2
GUID0
Full ReferenceLuo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research, 26 (12) 1468-1471 doi:10.1557/jmr.2011.179
Plain TextLuo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research, 26 (12) 1468-1471 doi:10.1557/jmr.2011.179
In(2011, June) Journal of Materials Research Vol. 26 (12) Springer Science and Business Media LLC

See Also

These are possibly similar items as determined by title/reference text matching only.

Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM. Journal of Materials Research, 26 (14) 1742 doi:10.1557/jmr.2011.222
Bae, Kyoo-Sik, Kim, Si-Jung (2002) Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints. Journal of Materials Research, 17 (4) 743-746 doi:10.1557/jmr.2002.0108
Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. Journal of Alloys and Compounds, 391. 82-89 doi:10.1016/j.jallcom.2004.09.001
Kim, S.H., Yu, Jin (2010) Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints. Journal of Materials Research, 25 (9) 1854-1858 doi:10.1557/jmr.2010.0232
Sobiech, Matthias, Krüger, Carmen, Welzel, Udo, Wang, Jiang-Yang, Mittemeijer, Eric Jan, Hügel, Werner (2011) Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics. Journal of Materials Research, 26 (12) 1482-1493 doi:10.1557/jmr.2011.162
Tang, Y., Guo, Q.W., Luo, S.M., Li, Z.H., Li, G.Y., Hou, C.J., Zhong, Z.Y., Zhuang, J.J. (2019) Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process. Journal of Alloys and Compounds, 778. 741-755 doi:10.1016/j.jallcom.2018.11.156
Yu, D.Q., Wu, C.M.L., He, D.P., Zhao, N., Wang, L., Lai, J.K.L. (2005) Effects of Cu Contents in Sn–Cu Solder on the Composition and Morphology of Intermetallic Compounds at a Solder/Ni Interface. Journal of Materials Research, 20 (8) 2205-2212 doi:10.1557/jmr.2005.0275
Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning (2016) In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. Journal of Materials Research, 31 (5) 609-617 doi:10.1557/jmr.2016.45
Wang, Yao Li, Zhang, Ke Ke, Li, Chen Yang, Han, Li Juan (2011) The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging. Materials Science Forum, 704. 685-689 doi:10.4028/www.scientific.net/msf.704-705.685
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 21, 2025 06:23:26
Go to top of page