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Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM. Journal of Materials Research, 26 (14) 1742 doi:10.1557/jmr.2011.222

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Reference TypeJournal (article/letter/editorial)
TitleFormation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM
JournalJournal of Materials Research
AuthorsLuo, ZhongbingAuthor
Wang, LaiAuthor
Fu, QinqinAuthor
Cheng, ChongqianAuthor
Zhao, JieAuthor
Year2011 (July 28)Volume26
Issue14
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2011.222Search in ResearchGate
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Mindat Ref. ID17102593Long-form Identifiermindat:1:5:17102593:6
GUID0
Full ReferenceLuo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM. Journal of Materials Research, 26 (14) 1742 doi:10.1557/jmr.2011.222
Plain TextLuo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM. Journal of Materials Research, 26 (14) 1742 doi:10.1557/jmr.2011.222
In(2011, July) Journal of Materials Research Vol. 26 (14) Springer Science and Business Media LLC

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Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, Zhao, Jie (2011) Formation of interfacial η′-Cu6Sn5in Sn–0.7Cu/Cu solder joints during isothermal aging. Journal of Materials Research, 26 (12) 1468-1471 doi:10.1557/jmr.2011.179
Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
Bae, Kyoo-Sik, Kim, Si-Jung (2002) Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints. Journal of Materials Research, 17 (4) 743-746 doi:10.1557/jmr.2002.0108
Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
Wang, Yao Li, Zhang, Ke Ke, Li, Chen Yang, Han, Li Juan (2011) The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging. Materials Science Forum, 704. 685-689 doi:10.4028/www.scientific.net/msf.704-705.685
Kim, S.H., Yu, Jin (2010) Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints. Journal of Materials Research, 25 (9) 1854-1858 doi:10.1557/jmr.2010.0232
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. Journal of Alloys and Compounds, 391. 82-89 doi:10.1016/j.jallcom.2004.09.001
Tang, Y., Guo, Q.W., Luo, S.M., Li, Z.H., Li, G.Y., Hou, C.J., Zhong, Z.Y., Zhuang, J.J. (2019) Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process. Journal of Alloys and Compounds, 778. 741-755 doi:10.1016/j.jallcom.2018.11.156
Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning (2016) In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. Journal of Materials Research, 31 (5) 609-617 doi:10.1557/jmr.2016.45
Yu, D.Q., Wu, C.M.L., He, D.P., Zhao, N., Wang, L., Lai, J.K.L. (2005) Effects of Cu Contents in Sn–Cu Solder on the Composition and Morphology of Intermetallic Compounds at a Solder/Ni Interface. Journal of Materials Research, 20 (8) 2205-2212 doi:10.1557/jmr.2005.0275
Chen, Sinn-Wen, Wang, Chao-Hong (2007) Effects of electromigration on interfacial reactions in cast Sn/Cu joints. Journal of Materials Research, 22 (3) 695-702 doi:10.1557/jmr.2007.0093
 
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