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Wu, Jie, Xue, Songbai, Wang, Jingwen, Huang, Guoqiang (2019) Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences, 9. 3590pp. doi:10.3390/app9173590

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Reference TypeJournal (article/letter/editorial)
TitleEffect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
JournalApplied Sciences
AuthorsWu, JieAuthor
Xue, SongbaiAuthor
Wang, JingwenAuthor
Huang, GuoqiangAuthor
Year2019 (September 2)Volume9
PublisherMDPI AG
DOIdoi:10.3390/app9173590Search in ResearchGate
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Mindat Ref. ID10099520Long-form Identifiermindat:1:5:10099520:0
GUID0
Full ReferenceWu, Jie, Xue, Songbai, Wang, Jingwen, Huang, Guoqiang (2019) Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences, 9. 3590pp. doi:10.3390/app9173590
Plain TextWu, Jie, Xue, Songbai, Wang, Jingwen, Huang, Guoqiang (2019) Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process. Applied Sciences, 9. 3590pp. doi:10.3390/app9173590
In(n.d.) Applied Sciences Vol. 9. MDPI AG

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Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging. Journal of Alloys and Compounds, 799. 124-136 doi:10.1016/j.jallcom.2019.05.226
Wu, Jie, Xue, Songbai, Huang, Guoqiang, Sun, Huabin, Chi, Fengfeng, Yang, Xiaolei, Xu, Yong (2022) In-situ synergistic effect of Pr and Al2O3 nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint. Journal of Alloys and Compounds, 905. 164152pp. doi:10.1016/j.jallcom.2022.164152
Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang (2019) Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder. Journal of Alloys and Compounds, 784. 471-487 doi:10.1016/j.jallcom.2019.01.034
Bo, Wang, Songbai, Xue, Jianxin, Wang, Weimin, Long, Qingke, Zhang (2018) Effect of Rare Earth Pr on Creep Behavior of Sn-0.3Ag-0.7Cu-0.5Ga Low-Ag Solder Alloys. Rare Metal Materials and Engineering, 47. 2657-2662 doi:10.1016/s1875-5372(18)30205-4
Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, Lai, Zhongmin (2011) Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition. Journal of Alloys and Compounds, 509. 7152-7161 doi:10.1016/j.jallcom.2011.04.037
WU, Jie, HUANG, Guo-qiang, XUE, Song-bai, XUE, Peng, XU, Yong (2022) Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint. Transactions of Nonferrous Metals Society of China, 32 (10) 3312-3320 doi:10.1016/s1003-6326(22)66022-9
Feng, Xiao Le, Yang, Jie (2015) Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder. Advanced Materials Research, 1120. 456-461 doi:10.4028/www.scientific.net/amr.1120-1121.456
Li, Z.H., Tang, Y., Guo, Q.W., Li, G.Y. (2019) Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys. Journal of Alloys and Compounds, 789. 150-162 doi:10.1016/j.jallcom.2019.03.013
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Wang, Ziyi, Xue, Songbai, Long, Weimin, Wang, Bo, Wang, Jianhao, Zhang, Peng (2020) Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint. Metals, 10 (10) 1373pp. doi:10.3390/met10101373
Wu, Jie, Xue, Songbai, Yao, Zhen, Long, Weimin (2021) Study on Microstructure and Properties of 12Ag–Cu–Zn–Sn Cadmium-Free Filler Metals with Trace In Addition. Crystals, 11 (5) 557pp. doi:10.3390/cryst11050557
 
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