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Chen, Chih-ming, Huang, Chih-chieh (2008) Effects of silver doping on electromigration of eutectic SnBi solder. Journal of Alloys and Compounds, 461. 235-241 doi:10.1016/j.jallcom.2007.07.059

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Reference TypeJournal (article/letter/editorial)
TitleEffects of silver doping on electromigration of eutectic SnBi solder
JournalJournal of Alloys and Compounds
AuthorsChen, Chih-mingAuthor
Huang, Chih-chiehAuthor
Year2008 (August)Volume461
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2007.07.059Search in ResearchGate
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Mindat Ref. ID11890787Long-form Identifiermindat:1:5:11890787:5
GUID0
Full ReferenceChen, Chih-ming, Huang, Chih-chieh (2008) Effects of silver doping on electromigration of eutectic SnBi solder. Journal of Alloys and Compounds, 461. 235-241 doi:10.1016/j.jallcom.2007.07.059
Plain TextChen, Chih-ming, Huang, Chih-chieh (2008) Effects of silver doping on electromigration of eutectic SnBi solder. Journal of Alloys and Compounds, 461. 235-241 doi:10.1016/j.jallcom.2007.07.059
In(n.d.) Journal of Alloys and Compounds Vol. 461. Elsevier BV

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Chen, Chih-ming, Huang, Chih-chieh (2008) Atomic migration in eutectic SnBi solder alloys due to current stressing. Journal of Materials Research, 23 (4) 1051-1056 doi:10.1557/jmr.2008.0128
Chen, Long-tai, Chen, Chih-ming (2006) Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization. Journal of Materials Research, 21 (4) 962-969 doi:10.1557/jmr.2006.0113
Chen, Chih-ming, Wang, Kai-jheng, Chen, Ko-chieh (2007) Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization. Journal of Alloys and Compounds, 432. 122-128 doi:10.1016/j.jallcom.2006.05.116
Liu, Chih-Yao, Hon, Min-Hsiung, Wang, Moo-Chin, Chen, Ying-Ru, Chang, Kuo-Ming, Li, Wang-Long (2014) Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys. Journal of Alloys and Compounds, 582. 229-235 doi:10.1016/j.jallcom.2013.08.022
Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan (2011) Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach. Journal of Alloys and Compounds, 509. 878-884 doi:10.1016/j.jallcom.2010.09.123
Lin, Chih-Fan, Hau, Nga Yu, Huang, Yu-Ting, Chang, Ya-Huei, Feng, Shien-Ping, Chen, Chih-Ming (2017) Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints. Journal of Alloys and Compounds, 708. 220-230 doi:10.1016/j.jallcom.2017.02.300
Ho, Cheng-En, Lee, Pei-Tzu, Chen, Chih-Nan, Yang, Cheng-Hsien (2016) Electromigration in 3D-IC scale Cu/Sn/Cu solder joints. Journal of Alloys and Compounds, 676. 361-368 doi:10.1016/j.jallcom.2016.03.134
Hsu, Ying-Chao, Huang, Yuan-Ming, Chen, Chih, Wang, Henry (2006) Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.8Sb0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization. Journal of Alloys and Compounds, 417. 180-186 doi:10.1016/j.jallcom.2005.06.087
Yang, Shih-Chi; Su, Hung-Chieh; Tu, King-Ning; Chen, Chih (2025) Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/SnAg/Ni/Cu microbumps. Journal of Alloys and Compounds, 1021. doi:10.1016/j.jallcom.2025.179631
Hsu, Chih-Chieh, Ting, Wei-Chieh, Chen, Yu-Ting (2017) Effects of substrate temperature on resistive switching behavior of planar ZnO resistive random access memories. Journal of Alloys and Compounds, 691. 537-544 doi:10.1016/j.jallcom.2016.08.248
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