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Chen, Long-tai, Chen, Chih-ming (2006) Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization. Journal of Materials Research, 21 (4) 962-969 doi:10.1557/jmr.2006.0113

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Reference TypeJournal (article/letter/editorial)
TitleElectromigration study in the eutectic SnBi solder joint on the Ni/Au metallization
JournalJournal of Materials Research
AuthorsChen, Long-taiAuthor
Chen, Chih-mingAuthor
Year2006 (April 1)Volume21
Issue4
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2006.0113Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID17104872Long-form Identifiermindat:1:5:17104872:0
GUID0
Full ReferenceChen, Long-tai, Chen, Chih-ming (2006) Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization. Journal of Materials Research, 21 (4) 962-969 doi:10.1557/jmr.2006.0113
Plain TextChen, Long-tai, Chen, Chih-ming (2006) Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization. Journal of Materials Research, 21 (4) 962-969 doi:10.1557/jmr.2006.0113
In(2006, April) Journal of Materials Research Vol. 21 (4) Springer Science and Business Media LLC

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Chen, Chih-ming, Huang, Chih-chieh (2008) Atomic migration in eutectic SnBi solder alloys due to current stressing. Journal of Materials Research, 23 (4) 1051-1056 doi:10.1557/jmr.2008.0128
Chen, Hsiao-Yun, Chen, Chih (2010) Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization. Journal of Materials Research, 25 (9) 1847-1853 doi:10.1557/jmr.2010.0230
Chen, Hsiao-Yun, Chen, Chih (2012) Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints. Journal of Materials Research, 27 (8) 1169-1177 doi:10.1557/jmr.2012.22
Chen, Chih-ming, Huang, Chih-chieh (2008) Effects of silver doping on electromigration of eutectic SnBi solder. Journal of Alloys and Compounds, 461. 235-241 doi:10.1016/j.jallcom.2007.07.059
Lai, C.L., Lin, C.H., Chen, Chih (2004) Electromigration at the high-Pb–eutectic SnPb solder interface. Journal of Materials Research, 19 (2) 550-556 doi:10.1557/jmr.2004.19.2.550
Chen, Y.H., Shao, T.L., Liu, P.C., Chen, Chih, Chou, T. (2005) Microstructural Evolution During Electromigration in Eutectic SnAg Solder Bumps. Journal of Materials Research, 20 (9) 2432-2442 doi:10.1557/jmr.2005.0291
Lu, C.M., Shao, T.L., Yang, C.J., Chen, Chih (2004) Microstructure evolution during electromigration in eutectic SnPb solder bumps. Journal of Materials Research, 19 (8) 2394-2401 doi:10.1557/jmr.2004.0305
Liao, Chien-Neng, Chung, Chien-Ping, Chen, Wen-Tai (2005) Electromigration-induced Pb segregation in eutectic Sn–Pb molten solder. Journal of Materials Research, 20 (12) 3425-3430 doi:10.1557/jmr.2005.0420
Chen, Chih-ming, Chen, Sinn-wen (2003) Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. Journal of Materials Research, 18 (6) 1293-1296 doi:10.1557/jmr.2003.0177
Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
Yoon, Jeong-Won, Jung, Seung-Boo (2006) Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder. Journal of Materials Research, 21 (6) 1590-1599 doi:10.1557/jmr.2006.0198
 
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