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Zang, Likun, Yuan, Zhangfu, Zhao, Hongxin, Zhang, Xiaorui (2009) Wettability of molten Sn–Bi–Cu solder on Cu substrate. Materials Letters, 63. 2067-2069 doi:10.1016/j.matlet.2009.06.052

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Reference TypeJournal (article/letter/editorial)
TitleWettability of molten Sn–Bi–Cu solder on Cu substrate
JournalMaterials Letters
AuthorsZang, LikunAuthor
Yuan, ZhangfuAuthor
Zhao, HongxinAuthor
Zhang, XiaoruiAuthor
Year2009 (September)Volume63
PublisherElsevier BV
DOIdoi:10.1016/j.matlet.2009.06.052Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID12415032Long-form Identifiermindat:1:5:12415032:6
GUID0
Full ReferenceZang, Likun, Yuan, Zhangfu, Zhao, Hongxin, Zhang, Xiaorui (2009) Wettability of molten Sn–Bi–Cu solder on Cu substrate. Materials Letters, 63. 2067-2069 doi:10.1016/j.matlet.2009.06.052
Plain TextZang, Likun, Yuan, Zhangfu, Zhao, Hongxin, Zhang, Xiaorui (2009) Wettability of molten Sn–Bi–Cu solder on Cu substrate. Materials Letters, 63. 2067-2069 doi:10.1016/j.matlet.2009.06.052
In(n.d.) Materials Letters Vol. 63. Elsevier BV

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Zhang, XiaoRui, Yuan, ZhangFu, Zhao, HongXin, Zang, LiKun, Li, JianQiang (2010) Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Chinese Science Bulletin, 55 (9). 797-801 doi:10.1007/s11434-010-0056-z
Li, Jianqiang, Ma, Bingqian, Min, Soonki, Lee, Joonho, Yuan, Zhangfu, Zang, Likun (2010) Effect of Ce addition on macroscopic core-shell structure of Cu–Sn–Bi immiscible alloy. Materials Letters, 64. 814-816 doi:10.1016/j.matlet.2010.01.018
Zhang, Xiaorui, Matsuura, Hiroyuki, Tsukihashi, Fumitaka, Yuan, Zhangfu (2012) Wettability of Sn–Zn, Sn–Ag–Cu and Sn–Bi–Cu Alloys on Copper Substrates. MATERIALS TRANSACTIONS, 53 (5). 926-931 doi:10.2320/matertrans.m2011349
Ervina, Efzan M.N., Tan, S.Y. (2013) Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan. Applied Mechanics and Materials, 315. 675-680 doi:10.4028/www.scientific.net/amm.315.675
Zang, LiKun, Yuan, ZhangFu, Zhan, YaPeng, Wang, ChenYu, Xu, BingSheng (2012) Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate. Chinese Science Bulletin, 57 (6). 682-686 doi:10.1007/s11434-011-4918-9
Liang, Yawei; Yang, Linmei; Yang, Jiyou; Ren, Hao; Buren, Bayaer (2025) Inhibition of Bi segregation in Sn-58Bi/Cu solder joint by controlling the grain of Cu substrate. Materials Letters, 395. doi:10.1016/j.matlet.2025.138689
Zhao, Guoji, Sheng, Guangmin, Xue, Haofei, Yuan, Xinjian (2012) Improved mechanical property of a Cu/Sn-9Zn-0.1Cr/Cu joint using a rapidly solidified solder. Materials Letters, 68. 129-132 doi:10.1016/j.matlet.2011.10.051
Zang, Li Kun, Yuan, Zhang Fu Yuan, Yan, Hong Liang, Li, Xin Xue (2012) Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures. Advanced Materials Research, 554. 703-708 doi:10.4028/www.scientific.net/amr.554-556.703
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Hongyan, Xu, Zhangfu, Yuan (2014) Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate. Rare Metal Materials and Engineering, 43. 2893-2897 doi:10.1016/s1875-5372(15)60028-5
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