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Zhang, XiaoRui, Yuan, ZhangFu, Zhao, HongXin, Zang, LiKun, Li, JianQiang (2010) Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Chinese Science Bulletin, 55 (9). 797-801 doi:10.1007/s11434-010-0056-z

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Reference TypeJournal (article/letter/editorial)
TitleWetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
JournalChinese Science Bulletin
AuthorsZhang, XiaoRuiAuthor
Yuan, ZhangFuAuthor
Zhao, HongXinAuthor
Zang, LiKunAuthor
Li, JianQiangAuthor
Year2010 (March)Volume55
Issue9
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s11434-010-0056-zSearch in ResearchGate
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Mindat Ref. ID7104712Long-form Identifiermindat:1:5:7104712:0
GUID0
Full ReferenceZhang, XiaoRui, Yuan, ZhangFu, Zhao, HongXin, Zang, LiKun, Li, JianQiang (2010) Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Chinese Science Bulletin, 55 (9). 797-801 doi:10.1007/s11434-010-0056-z
Plain TextZhang, XiaoRui, Yuan, ZhangFu, Zhao, HongXin, Zang, LiKun, Li, JianQiang (2010) Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Chinese Science Bulletin, 55 (9). 797-801 doi:10.1007/s11434-010-0056-z
In(2010, March) Chinese Science Bulletin Vol. 55 (9) Springer Science and Business Media LLC

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