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Xu, Bing-Sheng, Zang, Li-Kun, Yuan, Zhang-Fu, Wu, Yan, Zhou, Zhou (2013) Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate. Rare Metals, 32. 537-543 doi:10.1007/s12598-013-0167-1

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Reference TypeJournal (article/letter/editorial)
TitleDissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate
JournalRare Metals
AuthorsXu, Bing-ShengAuthor
Zang, Li-KunAuthor
Yuan, Zhang-FuAuthor
Wu, YanAuthor
Zhou, ZhouAuthor
Year2013 (December)Volume32
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s12598-013-0167-1Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8049658Long-form Identifiermindat:1:5:8049658:6
GUID0
Full ReferenceXu, Bing-Sheng, Zang, Li-Kun, Yuan, Zhang-Fu, Wu, Yan, Zhou, Zhou (2013) Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate. Rare Metals, 32. 537-543 doi:10.1007/s12598-013-0167-1
Plain TextXu, Bing-Sheng, Zang, Li-Kun, Yuan, Zhang-Fu, Wu, Yan, Zhou, Zhou (2013) Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate. Rare Metals, 32. 537-543 doi:10.1007/s12598-013-0167-1
In(2013) Rare Metals Vol. 32. Springer Science and Business Media LLC

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Zang, Li Kun, Yan, Hong Liang, Yuan, Zhang Fu, Lu, Li Ying (2013) Wetting Behavior and Interfacial Characteristic of the Sn-3.5Ag Alloy on Ni Substrates. Advanced Materials Research, 834. 335-339 doi:10.4028/www.scientific.net/amr.834-836.335
Zang, Likun, Yuan, Zhangfu, Xu, Hongyan, Xu, Bingsheng (2011) Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673K. Applied Surface Science, 257. 4877-4884 doi:10.1016/j.apsusc.2010.12.131
Zang, Likun, Yuan, Zhangfu, Zhu, Yuanqing, Xu, Bingsheng, Matsuura, Hiroyuki, Tsukihashi, Fumitaka (2012) Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523K to 673K. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 414. 57-65 doi:10.1016/j.colsurfa.2012.08.052
Zhang, XiaoRui, Yuan, ZhangFu, Zhao, HongXin, Zang, LiKun, Li, JianQiang (2010) Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Chinese Science Bulletin, 55 (9). 797-801 doi:10.1007/s11434-010-0056-z
Zang, Li Kun, Yuan, Zhang Fu Yuan, Yan, Hong Liang, Li, Xin Xue (2012) Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures. Advanced Materials Research, 554. 703-708 doi:10.4028/www.scientific.net/amr.554-556.703
Luo, Peng, Wang, Sheng-Nan, Zhao, Ting-Ting, Li, Yan (2013) Surface characteristics, corrosion behavior, and antibacterial property of Ag-implanted NiTi alloy. Rare Metals, 32. 113-121 doi:10.1007/s12598-013-0041-1
Dong, Bing-Hui, Wu, Feng, Alajmi, Zafer, Zhang, Chen, Fu, Tao, Ge, Yuan (2014) Sol–gel derived Ta-containing TiO2 films on surface roughened NiTi alloy. Rare Metals, 33. 21-27 doi:10.1007/s12598-013-0208-9
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Yuan, Jun-Ping, Li, Wei, Liu, Wen-Ming (2013) Nickel release rate of 18 KW gold alloy for ornaments. Rare Metals, 32. 33-39 doi:10.1007/s12598-013-0017-1
 
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