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Park, Jaehong, Jung, Haedo, Yoshida, Koichi, Kinoshita, Masaharu (2008) Pad Surface Treatment to Control Performance of Chemical Mechanical Planarization. Japanese Journal of Applied Physics, 47 (2) 1028-1033 doi:10.1143/jjap.47.1028

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Reference TypeJournal (article/letter/editorial)
TitlePad Surface Treatment to Control Performance of Chemical Mechanical Planarization
JournalJapanese Journal of Applied Physics
AuthorsPark, JaehongAuthor
Jung, HaedoAuthor
Yoshida, KoichiAuthor
Kinoshita, MasaharuAuthor
Year2008 (February 15)Volume47
Issue2
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.47.1028Search in ResearchGate
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Mindat Ref. ID15031380Long-form Identifiermindat:1:5:15031380:1
GUID0
Full ReferencePark, Jaehong, Jung, Haedo, Yoshida, Koichi, Kinoshita, Masaharu (2008) Pad Surface Treatment to Control Performance of Chemical Mechanical Planarization. Japanese Journal of Applied Physics, 47 (2) 1028-1033 doi:10.1143/jjap.47.1028
Plain TextPark, Jaehong, Jung, Haedo, Yoshida, Koichi, Kinoshita, Masaharu (2008) Pad Surface Treatment to Control Performance of Chemical Mechanical Planarization. Japanese Journal of Applied Physics, 47 (2) 1028-1033 doi:10.1143/jjap.47.1028
In(2008, February) Japanese Journal of Applied Physics Vol. 47 (2) Japan Society of Applied Physics

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Park, Boumyoung, Lee, Hyunseop, Kim, Youngjin, Kim, Hyoungjae, Jeong, Haedo (2008) Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing. Japanese Journal of Applied Physics, 47 (12) 8771-8778 doi:10.1143/jjap.47.8771
Sun, Ting, Zhuang, Yun, Borucki, Leonard, Philipossian, Ara (2010) Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy. Japanese Journal of Applied Physics, 49 (6) 66501 doi:10.1143/jjap.49.066501
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