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Jeong, Sukhoon, Joo, Sukbae, Kim, Hyoungjae, Kim, Sungryul, Jeong, Haedo (2009) Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization. Japanese Journal of Applied Physics, 48 (6) 66512 doi:10.1143/jjap.48.066512

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Reference TypeJournal (article/letter/editorial)
TitleEffect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization
JournalJapanese Journal of Applied Physics
AuthorsJeong, SukhoonAuthor
Joo, SukbaeAuthor
Kim, HyoungjaeAuthor
Kim, SungryulAuthor
Jeong, HaedoAuthor
Year2009 (June 22)Volume48
Issue6
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.48.066512Search in ResearchGate
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Mindat Ref. ID15033908Long-form Identifiermindat:1:5:15033908:5
GUID0
Full ReferenceJeong, Sukhoon, Joo, Sukbae, Kim, Hyoungjae, Kim, Sungryul, Jeong, Haedo (2009) Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization. Japanese Journal of Applied Physics, 48 (6) 66512 doi:10.1143/jjap.48.066512
Plain TextJeong, Sukhoon, Joo, Sukbae, Kim, Hyoungjae, Kim, Sungryul, Jeong, Haedo (2009) Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization. Japanese Journal of Applied Physics, 48 (6) 66512 doi:10.1143/jjap.48.066512
In(2009, June) Japanese Journal of Applied Physics Vol. 48 (6) Japan Society of Applied Physics

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