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Nemoto, Takenao, Fukino, Tatsuya, Tsurekawa, Sadahiro, Gu, Xun, Teramoto, Akinobu, Ohmi, Tadahiro (2009) In situObservation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction. Japanese Journal of Applied Physics, 48 (6) 66507 doi:10.1143/jjap.48.066507

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Reference TypeJournal (article/letter/editorial)
TitleIn situObservation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction
JournalJapanese Journal of Applied Physics
AuthorsNemoto, TakenaoAuthor
Fukino, TatsuyaAuthor
Tsurekawa, SadahiroAuthor
Gu, XunAuthor
Teramoto, AkinobuAuthor
Ohmi, TadahiroAuthor
Year2009 (June 22)Volume48
Issue6
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.48.066507Search in ResearchGate
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Mindat Ref. ID15033903Long-form Identifiermindat:1:5:15033903:0
GUID0
Full ReferenceNemoto, Takenao, Fukino, Tatsuya, Tsurekawa, Sadahiro, Gu, Xun, Teramoto, Akinobu, Ohmi, Tadahiro (2009) In situObservation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction. Japanese Journal of Applied Physics, 48 (6) 66507 doi:10.1143/jjap.48.066507
Plain TextNemoto, Takenao, Fukino, Tatsuya, Tsurekawa, Sadahiro, Gu, Xun, Teramoto, Akinobu, Ohmi, Tadahiro (2009) In situObservation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction. Japanese Journal of Applied Physics, 48 (6) 66507 doi:10.1143/jjap.48.066507
In(2009, June) Japanese Journal of Applied Physics Vol. 48 (6) Japan Society of Applied Physics

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