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Tominaga, Shigeru, Abe, Daisuke, Enomoto, Taro, Kondo, Seiichi, Kitada, Hideki, Ohba, Takayuki (2010) Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad. Japanese Journal of Applied Physics, 49 (5) 5 doi:10.1143/jjap.49.05fg01

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Reference TypeJournal (article/letter/editorial)
TitleHybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad
JournalJapanese Journal of Applied Physics
AuthorsTominaga, ShigeruAuthor
Abe, DaisukeAuthor
Enomoto, TaroAuthor
Kondo, SeiichiAuthor
Kitada, HidekiAuthor
Ohba, TakayukiAuthor
Year2010 (May 20)Volume49
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.49.05fg01Search in ResearchGate
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Mindat Ref. ID15035568Long-form Identifiermindat:1:5:15035568:9
GUID0
Full ReferenceTominaga, Shigeru, Abe, Daisuke, Enomoto, Taro, Kondo, Seiichi, Kitada, Hideki, Ohba, Takayuki (2010) Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad. Japanese Journal of Applied Physics, 49 (5) 5 doi:10.1143/jjap.49.05fg01
Plain TextTominaga, Shigeru, Abe, Daisuke, Enomoto, Taro, Kondo, Seiichi, Kitada, Hideki, Ohba, Takayuki (2010) Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad. Japanese Journal of Applied Physics, 49 (5) 5 doi:10.1143/jjap.49.05fg01
In(2010, May) Japanese Journal of Applied Physics Vol. 49 (5) Japan Society of Applied Physics

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