Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Fukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu (2012) Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef01

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleInfluence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch
JournalJapanese Journal of Applied Physics
AuthorsFukuda, AkiraAuthor
Fukuda, TetsuoAuthor
Fukunaga, AkiraAuthor
Tsujimura, ManabuAuthor
Year2012 (May 1)Volume51
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.7567/jjap.51.05ef01Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15042708Long-form Identifiermindat:1:5:15042708:9
GUID0
Full ReferenceFukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu (2012) Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef01
Plain TextFukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu (2012) Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef01
In(2012, May) Japanese Journal of Applied Physics Vol. 51 (5) Japan Society of Applied Physics

See Also

These are possibly similar items as determined by title/reference text matching only.

Fukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu (2012) Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef01
Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu (2011) Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.7567/jjap.50.05ec04
Kodera, Masako, Fukuda, Akira, Mochizuki, Yoshihiro, Hiyama, Hirokuni, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu (2005) Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-kStructures of LSI Devices. Japanese Journal of Applied Physics, 44 (12) 8401-8408 doi:10.1143/jjap.44.8401
Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu (2011) Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.1143/jjap.50.05ec04
Fukuda, Akira, Kodera, Akira, Toma, Yasushi, Suzuki, Tsukuru, Hiyama, Hirokuni, Doi, Toshiro, Kurokawa, Syuhei, Ohnishi, Osamu (2010) Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing. Japanese Journal of Applied Physics, 49 (7) 76701 doi:10.1143/jjap.49.076701
Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu (2010) Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment Using Photodiode and Quartz Crystal Microbalance. Japanese Journal of Applied Physics, 49 (5) 5 doi:10.1143/jjap.49.05ff05
Kodera, Masako, Mochizuki, Yoshihiro, Fukuda, Akira, Hiyama, Hirokuni, Tsujimura, Manabu (2007) Shear Stress Analyses in Chemical Mechanical Planarization with Cu/Porous Low-kStructure. Japanese Journal of Applied Physics, 46 (4) 1974-1980 doi:10.1143/jjap.46.1974
Kodera, Masako, Nishioka, Yukiko, Shima, Shohei, Fukunaga, Akira, Tsujimura, Manabu (2005) Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing. Japanese Journal of Applied Physics, 44 (12) 8396-8400 doi:10.1143/jjap.44.8396
Tsujimura, Manabu (2016) The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies. Japanese Journal of Applied Physics, 55 (6) 6 doi:10.7567/jjap.55.06ja01
Nitta, Hiroshi, Isobe, Akira, Hong, Park, Hirao, Takashi (2011) Research on Reaction Method of High Removal Rate Chemical Mechanical Polishing Slurry for 4H-SiC Substrate. Japanese Journal of Applied Physics, 50 (4) 46501 doi:10.7567/jjap.50.046501
Mizushima, Yoriko, Kim, Youngsuk, Nakamura, Tomoji, Sugie, Ryuichi, Hashimoto, Hideki, Uedono, Akira, Ohba, Takayuki (2014) Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration. Japanese Journal of Applied Physics, 53 (5) 5 doi:10.7567/jjap.53.05ge04
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are Β© OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 21, 2025 14:42:25
Go to top of page