Vote for your favorite mineral in #MinCup25! - Silver vs. Baryte
Are you ready for beautiful utility as sparkling silver competes against hefty baryte?
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Lin, Chon-Hsin (2015) New Cu(GeNx) film in barrierless metallization for LED heat dissipation. Japanese Journal of Applied Physics, 54 (5) 5 doi:10.7567/jjap.54.05ed04

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleNew Cu(GeNx) film in barrierless metallization for LED heat dissipation
JournalJapanese Journal of Applied Physics
AuthorsLin, Chon-HsinAuthor
Year2015 (May 1)Volume54
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.7567/jjap.54.05ed04Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15044923Long-form Identifiermindat:1:5:15044923:4
GUID0
Full ReferenceLin, Chon-Hsin (2015) New Cu(GeNx) film in barrierless metallization for LED heat dissipation. Japanese Journal of Applied Physics, 54 (5) 5 doi:10.7567/jjap.54.05ed04
Plain TextLin, Chon-Hsin (2015) New Cu(GeNx) film in barrierless metallization for LED heat dissipation. Japanese Journal of Applied Physics, 54 (5) 5 doi:10.7567/jjap.54.05ed04
In(2015, May) Japanese Journal of Applied Physics Vol. 54 (5) Japan Society of Applied Physics

See Also

These are possibly similar items as determined by title/reference text matching only.

Lin, Chon-Hsin (2016) Erratum: “New Cu(GeN x ) film in barrierless metallization for LED heat dissipation”. Japanese Journal of Applied Physics, 55 (12) 129202 doi:10.7567/jjap.55.129202
Lin, Chon-Hsin (2012) A Thermally-Reliable, Low-Resistivity Cu(Ir) and Cu(IrN) Alloy Films for Barrierless Cu Metallization. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ea05
Lin, Chon-Hsin (2014) A new Cu(GeNx) alloy film for industrial applications. Japanese Journal of Applied Physics, 53 (11) 11 doi:10.7567/jjap.53.11rc05
Lin, Chon-Hsin (2012) A Thermally-Reliable, Low-Resistivity Cu(Ir) and Cu(IrN) Alloy Films for Barrierless Cu Metallization. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ea05
Lin, Chon-Hsin (2014) A new Cu(TiIrNx) film with fine thermal conductivity and its application. Japanese Journal of Applied Physics, 53 (5) 5 doi:10.7567/jjap.53.05ga01
Lin, Chon-Hsin (2016) New Cu(AuTiNx) copper alloy film and its features. Japanese Journal of Applied Physics, 55 (1) 1 doi:10.7567/jjap.55.01aa13
Lin, Chon-Hsin (2016) New Cu(TiBNx) copper alloy films for industrial applications. Japanese Journal of Applied Physics, 55 (6) 6 doi:10.7567/jjap.55.06jd02
Lin, Chon-Hsin (2011) New Copper Alloy, Cu(SnNx), Films Suitable for More Thermally Stable, Electrically Reliable Interconnects and Lower-Leakage Current Capacitors. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.7567/jjap.50.05ea04
Lin, Chon-Hsin (2017) A new Cu(TiBN x ) alloy film for boosting the per-watt illuminance of high power LEDs. Japanese Journal of Applied Physics, 56 (1) 1 doi:10.7567/jjap.56.01ab09
(2015) Advanced Metallization for ULSI Applications. Japanese Journal of Applied Physics, 54 (5) 50 doi:10.7567/jjap.54.05e001
Lin, Chon-Hsin, Leau, Wen-Kuan, Wu, Cheng-Hui (2010) Copper–Holmium Alloy Film for Reliable Interconnects. Japanese Journal of Applied Physics, 49 (5) 5 doi:10.1143/jjap.49.05fa03
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 5, 2025 15:30:45
Go to top of page