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Lee, Kiju, Kim, Keun-Soo, Suganuma, Katsuaki (2011) Influence of indium addition on electromigration behavior of solder joint. Journal of Materials Research, 26 (20) 2624-2631 doi:10.1557/jmr.2011.283

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Reference TypeJournal (article/letter/editorial)
TitleInfluence of indium addition on electromigration behavior of solder joint
JournalJournal of Materials Research
AuthorsLee, KijuAuthor
Kim, Keun-SooAuthor
Suganuma, KatsuakiAuthor
Year2011 (October 28)Volume26
Issue20
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2011.283Search in ResearchGate
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Mindat Ref. ID17102503Long-form Identifiermindat:1:5:17102503:5
GUID0
Full ReferenceLee, Kiju, Kim, Keun-Soo, Suganuma, Katsuaki (2011) Influence of indium addition on electromigration behavior of solder joint. Journal of Materials Research, 26 (20) 2624-2631 doi:10.1557/jmr.2011.283
Plain TextLee, Kiju, Kim, Keun-Soo, Suganuma, Katsuaki (2011) Influence of indium addition on electromigration behavior of solder joint. Journal of Materials Research, 26 (20) 2624-2631 doi:10.1557/jmr.2011.283
In(2011, October) Journal of Materials Research Vol. 26 (20) Springer Science and Business Media LLC

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Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi (2005) Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. MATERIALS TRANSACTIONS, 46 (11). 2413-2418 doi:10.2320/matertrans.46.2413
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