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Bonifacio, C.S., Campin, M., McIlwrath, K., Ray, M., Fischione, P.E. (2018) Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits. Microscopy and Microanalysis, 24. 150-151 doi:10.1017/s1431927618001241

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Reference TypeJournal (article/letter/editorial)
TitleSample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits
JournalMicroscopy and Microanalysis
AuthorsBonifacio, C.S.Author
Campin, M.Author
McIlwrath, K.Author
Ray, M.Author
Fischione, P.E.Author
Year2018 (August)Volume24
PublisherCambridge University Press (CUP)
DOIdoi:10.1017/s1431927618001241Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID4882456Long-form Identifiermindat:1:5:4882456:7
GUID0
Full ReferenceBonifacio, C.S., Campin, M., McIlwrath, K., Ray, M., Fischione, P.E. (2018) Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits. Microscopy and Microanalysis, 24. 150-151 doi:10.1017/s1431927618001241
Plain TextBonifacio, C.S., Campin, M., McIlwrath, K., Ray, M., Fischione, P.E. (2018) Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits. Microscopy and Microanalysis, 24. 150-151 doi:10.1017/s1431927618001241
In(2018) Microscopy and Microanalysis Vol. 24. Cambridge University Press (CUP)

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Nowakowski, P., Bonifacio, C.S., Campin, M.J., Ray, M.L., Fischione, P.E. (2017) Accurate Removal of Implanted Gallium and Amorphous Damage from TEM Specimens after Focused Ion Beam (FIB) Preparation. Microscopy and Microanalysis, 23. 300-301 doi:10.1017/s1431927617002185
Bonifacio, C.S., Giannuzzi, L.A., Nowakowski, P., Harbaugh, J.T., Campin, M., Boccabella, M., Ray, M., Fischione, P.E. (2018) Automatic End-point Detection for Ar+ Milling of FIB in situ and ex situ Lift-out Specimens from Semiconductor Devices. Microscopy and Microanalysis, 24. 854-855 doi:10.1017/s1431927618004762
Campin, M.J., Bonifacio, C.S., Fischione, P.E. (2018) Low-Energy Argon Broad Ion Beam and Narrow Ion Beam Milling of In Situ Lift-Out FIB Specimens. Microscopy and Microanalysis, 24. 862-863 doi:10.1017/s1431927618004804
Bonifacio, C.S., Campin, M.J., Nowakowski, P., Boccabella, M., Giannuzzi, L.A., Fischione, P.E. (2017) Targeted Ion Milling of Ex Situ Lift-Out FIB Specimens. Microscopy and Microanalysis, 23. 268-269 doi:10.1017/s1431927617002021
Bonifacio, C.S., Nowakowski, P., Costello, K., Ray, M.L., Morrison, R., Fischione, P.E. (2019) Controlled Environments from Sample Preparation to Electron Microscopy Characterization. Microscopy and Microanalysis, 25. 698-699 doi:10.1017/s1431927619004227
Bonifacio, C.S., Nowakowski, P., Costello, K., Ray, M.L., Morrison, R., Fischione, P.E. (2019) Post-FIB Specimen Preparation of Atom Probe Specimens under Controlled Environments for Correlative Microscopy. Microscopy and Microanalysis, 25. 2554-2555 doi:10.1017/s1431927619013503
Campin, M.J., Bonifacio, C.S., Kang, H.H., Nowakowski, P., Boccabella, M., Fischione, P.E. (2017) Narrow-Beam Argon Ion Milling of Carbon-Supported Ex Situ Lift-Out FIB Specimens. Microscopy and Microanalysis, 23. 302-303 doi:10.1017/s1431927617002197
Bonifacio, C.S., Tan, S., Nowakowski, P., Ray, M.L., Fischione, P.E. (2022) Raman Spectroscopy and Electron Microscopy Studies of Ga FIB and Post-FIB Ar Ion Milling's Impact on Si TEM Specimens. Microscopy and Microanalysis, 28. 52-53 doi:10.1017/s143192762200112x
Bonifacio, C.S., Rice, K.P., Prosa, T.J., Ray, M., Kelly, T.F., Fischione, P.E. (2018) Removal of Ga Implantation on FIB-prepared Atom Probe Specimens Using Small Beam and Low Energy Ar+ Milling. Microscopy and Microanalysis, 24. 1118-1119 doi:10.1017/s1431927618006074
Genç, A, Huber, D, Basile, D, Fraser, HL, Fischione, P (2008) Sample Preparation for Aberration Corrected Microscopy. Microscopy and Microanalysis, 14. 998-999 doi:10.1017/s1431927608083669
Nowakowski, Pawel, Bonifacio, Cecile, Ray, Mary, Fischione, Paul (2019) Combining Emerging Sample Preparation Methods, SEM, and TEM Investigations for Microelectronics Device Characterization at Multiple Scales. Microscopy and Microanalysis, 25. 688-689 doi:10.1017/s1431927619004173
 
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