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Tian, Xiubo, Chu, Paul K. (2000) Direct temperature monitoring for semiconductors in plasma immersion ion implantation. Review of Scientific Instruments, 71 (7). 2839-2842 doi:10.1063/1.1150700

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Reference TypeJournal (article/letter/editorial)
TitleDirect temperature monitoring for semiconductors in plasma immersion ion implantation
JournalReview of Scientific Instruments
AuthorsTian, XiuboAuthor
Chu, Paul K.Author
Year2000 (July)Volume71
Issue7
PublisherAIP Publishing
DOIdoi:10.1063/1.1150700Search in ResearchGate
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Mindat Ref. ID4884080Long-form Identifiermindat:1:5:4884080:2
GUID0
Full ReferenceTian, Xiubo, Chu, Paul K. (2000) Direct temperature monitoring for semiconductors in plasma immersion ion implantation. Review of Scientific Instruments, 71 (7). 2839-2842 doi:10.1063/1.1150700
Plain TextTian, Xiubo, Chu, Paul K. (2000) Direct temperature monitoring for semiconductors in plasma immersion ion implantation. Review of Scientific Instruments, 71 (7). 2839-2842 doi:10.1063/1.1150700
In(2000, July) Review of Scientific Instruments Vol. 71 (7) AIP Publishing

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Tian, Xiubo, Fan, Zhineng, Zeng, Xuchu, Zeng, Zhaoming, Tang, Baoyin, Chu, Paul K. (1999) In situ sample temperature measurement in plasma immersion ion implantation. Review of Scientific Instruments, 70 (6). 2818-2821 doi:10.1063/1.1149801
Fu, Ricky K. Y., Tian, Xiubo, Chu, Paul K. (2003) Enhancement of implantation energy using a conducting grid in plasma immersion ion implantation of dielectric/polymeric materials. Review of Scientific Instruments, 74 (8). 3697-3700 doi:10.1063/1.1588757
Gong, Chunzhi, Tian, Xiubo, Yang, Shiqin, Fu, Ricky K. Y., Chu, Paul K. (2008) Direct coupling of pulsed radio frequency and pulsed high power in novel pulsed power system for plasma immersion ion implantation. Review of Scientific Instruments, 79 (4). 43501pp. doi:10.1063/1.2906220
Tian, Xiubo, Fu, Ricky K. Y., Chu, Paul K., Anders, Andre, Gong, Chunzhi, Yang, Shiqin (2003) Flexible system for multiple plasma immersion ion implantation-deposition processes. Review of Scientific Instruments, 74 (12). 5137-5140 doi:10.1063/1.1626012
Tian, Xiubo, Wang, Xiaofeng, Tang, Baoyin, Chu, Paul K., Ko, Ping K., Cheng, Yiu-Chung (1999) Special modulator for high frequency, low-voltage plasma immersion ion implantation. Review of Scientific Instruments, 70 (3). 1824-1828 doi:10.1063/1.1149675
Zhu, Zongtao, Gong, Chunzhi, Tian, Xiubo, Yang, Shiqin, Fu, Ricky K. Y., Chu, Paul K. (2011) High voltage pulser with a fast fall-time for plasma immersion ion implantation. Review of Scientific Instruments, 82 (4). 45102pp. doi:10.1063/1.3575320
Tian, Xiubo, Tang, Baoyin, Chu, Paul K. (1999) Accurate determination of pulsed current waveform in plasma immersion ion implantation processes. Journal of Applied Physics, 86 (7). 3567-3570 doi:10.1063/1.371259
Fu, Ricky K. Y., Chu, Paul K., Tian, Xiubo (2004) Influence of thickness and dielectric properties on implantation efficacy in plasma immersion ion implantation of insulators. Journal of Applied Physics, 95 (7). 3319-3323 doi:10.1063/1.1666976
Tian, Xiubo, Chu, Paul K. (2000) Modeling of the relationship between implantation parameters and implantation dose during plasma immersion ion implantation. Physics Letters A, 277. 42-46 doi:10.1016/s0375-9601(00)00673-3
Wu, Zhongzhen, Tian, Xiubo, Shi, Jingwei, Wang, Zeming, Gong, Chunzhi, Yang, Shiqin, Chu, Paul K. (2011) Novel plasma immersion ion implantation and deposition hardware and technique based on high power pulsed magnetron discharge. Review of Scientific Instruments, 82 (3). 33511pp. doi:10.1063/1.3565175
Wang, L. P., Gan, K. Y., Tian, X. B., Tang, B. Y., Chu, P. K. (2000) Characteristics and design of metal vacuum arc plasma source power supply for pulsed-mode plasma immersion ion implantation. Review of Scientific Instruments, 71 (12). 4435pp. doi:10.1063/1.1327312
 
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