Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2007) The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits. Journal of Applied Physics, 101 (7). 74501pp. doi:10.1063/1.2714668
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits | ||
Journal | Journal of Applied Physics | ||
Authors | Hwang, Sang-Soo | Author | |
Jung, Sung-Yup | Author | ||
Joo, Young-Chang | Author | ||
Year | 2007 (April) | Volume | 101 |
Issue | 7 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.2714668Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 5147966 | Long-form Identifier | mindat:1:5:5147966:8 |
GUID | 0 | ||
Full Reference | Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2007) The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits. Journal of Applied Physics, 101 (7). 74501pp. doi:10.1063/1.2714668 | ||
Plain Text | Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2007) The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits. Journal of Applied Physics, 101 (7). 74501pp. doi:10.1063/1.2714668 | ||
In | (2007, April) Journal of Applied Physics Vol. 101 (7) AIP Publishing |
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