Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2008) Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress. Journal of Applied Physics, 104 (4). 44511pp. doi:10.1063/1.2973154
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress | ||
Journal | Journal of Applied Physics | ||
Authors | Hwang, Sang-Soo | Author | |
Jung, Sung-Yup | Author | ||
Joo, Young-Chang | Author | ||
Year | 2008 (August 15) | Volume | 104 |
Issue | 4 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.2973154Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 5159356 | Long-form Identifier | mindat:1:5:5159356:0 |
GUID | 0 | ||
Full Reference | Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2008) Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress. Journal of Applied Physics, 104 (4). 44511pp. doi:10.1063/1.2973154 | ||
Plain Text | Hwang, Sang-Soo, Jung, Sung-Yup, Joo, Young-Chang (2008) Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress. Journal of Applied Physics, 104 (4). 44511pp. doi:10.1063/1.2973154 | ||
In | (2008, August) Journal of Applied Physics Vol. 104 (4) AIP Publishing |
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