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Wu, Cheng-Da, Fang, Te-Hua, Kuo, Ching-Hung (2015) Atomistic simulation of nanodrilling mechanics and mechanism on Cu substrates. Applied Physics A, 118. 307-313 doi:10.1007/s00339-014-8732-5

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Reference TypeJournal (article/letter/editorial)
TitleAtomistic simulation of nanodrilling mechanics and mechanism on Cu substrates
JournalApplied Physics A
AuthorsWu, Cheng-DaAuthor
Fang, Te-HuaAuthor
Kuo, Ching-HungAuthor
Year2015 (January)Volume118
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s00339-014-8732-5Search in ResearchGate
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Mindat Ref. ID6017613Long-form Identifiermindat:1:5:6017613:4
GUID0
Full ReferenceWu, Cheng-Da, Fang, Te-Hua, Kuo, Ching-Hung (2015) Atomistic simulation of nanodrilling mechanics and mechanism on Cu substrates. Applied Physics A, 118. 307-313 doi:10.1007/s00339-014-8732-5
Plain TextWu, Cheng-Da, Fang, Te-Hua, Kuo, Ching-Hung (2015) Atomistic simulation of nanodrilling mechanics and mechanism on Cu substrates. Applied Physics A, 118. 307-313 doi:10.1007/s00339-014-8732-5
In(2015) Applied Physics A Vol. 118. Springer Science and Business Media LLC

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Wu, Cheng-Da, Fang, Te-Hua, Wu, Chung-Chin (2015) Atomistic simulations of nanowelding of single-crystal and amorphous gold nanowires. Journal of Applied Physics, 117 (1). 14307pp. doi:10.1063/1.4905350
Wu, Cheng-Da, Fang, Te-Hua, Wu, Chung-Chin (2016) Size effect on cold-welding of gold nanowires investigated using molecular dynamics simulations. Applied Physics A, 122. doi:10.1007/s00339-016-9770-y
Wu, Cheng-Da, Liu, Kai-Wei, Cheng, Po-Chien (2023) Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation. Applied Physics A, 129 (4) doi:10.1007/s00339-023-06558-5
Wu, Cheng-Da, Fang, Te-Hua, Su, Jih-Kai (2017) Nanometric mechanical cutting of metallic glass investigated using atomistic simulation. Applied Surface Science, 396. 319-326 doi:10.1016/j.apsusc.2016.10.143
Lin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Kuo, Li-Min (2012) Effects of layered structure, composition, and annealing on nanoformed Au–Cu rods using molecular dynamics simulation. Computational Materials Science, 59. 114-120 doi:10.1016/j.commatsci.2012.03.003
Lin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Chen, Guan-Hung (2012) Effects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation. Applied Surface Science, 258. 5892-5897 doi:10.1016/j.apsusc.2012.02.133
Fang, Te-Hua, Wu, Cheng-Da, Chang, Win-Jin, Chi, Sung-Shui (2009) Effect of thermal annealing on nanoimprinted Cu–Ni alloys using molecular dynamics simulation. Applied Surface Science, 255. 6043-6047 doi:10.1016/j.apsusc.2009.01.069
Wang, Tong Hong, Fang, Te-Hua, Lin, Yu-Cheng (2008) Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation. Applied Physics A, 90. 457-463 doi:10.1007/s00339-007-4303-3
Wu, Cheng-Da, Fang, Te-Hua, Lin, Jen-Fin (2010) Formation Mechanism and Mechanics of Dip-Pen Nanolithography Using Molecular Dynamics. Langmuir, 26. 3237-3241 doi:10.1021/la9029112
Fang, Te-Hua, Liu, Chien-Hung, Shen, Siu-Tsen, Prior, S.D., Ji, Liang-Wen, Wu, Jia-Hung (2008) Nanoscratch behavior of multi-layered films using molecular dynamics. Applied Physics A, 90. 753-758 doi:10.1007/s00339-007-4351-8
Lin, Shiang-Jiun, Wu, Cheng-Da, Fang, Te-Hua, Kuo, Li-Min (2011) Effects of forging temperature and velocity on nano-forming process using molecular dynamics simulation. Computational Materials Science, 50 (10). 2918-2924 doi:10.1016/j.commatsci.2011.05.008
 
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