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Hirose, Akio, Fujii, Toshio, Imamura, Takeshi, Kobayashi, Kojiro F. (2001) Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders. MATERIALS TRANSACTIONS, 42 (5). 794-802 doi:10.2320/matertrans.42.794

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Reference TypeJournal (article/letter/editorial)
TitleInfluence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
JournalMATERIALS TRANSACTIONS
AuthorsHirose, AkioAuthor
Fujii, ToshioAuthor
Imamura, TakeshiAuthor
Kobayashi, Kojiro F.Author
Year2001Volume42
Issue5
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.42.794Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7775898Long-form Identifiermindat:1:5:7775898:1
GUID0
Full ReferenceHirose, Akio, Fujii, Toshio, Imamura, Takeshi, Kobayashi, Kojiro F. (2001) Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders. MATERIALS TRANSACTIONS, 42 (5). 794-802 doi:10.2320/matertrans.42.794
Plain TextHirose, Akio, Fujii, Toshio, Imamura, Takeshi, Kobayashi, Kojiro F. (2001) Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders. MATERIALS TRANSACTIONS, 42 (5). 794-802 doi:10.2320/matertrans.42.794
In(2001) MATERIALS TRANSACTIONS Vol. 42 (5) Japan Institute of Metals

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Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, Hirose, Akio, Kobayashi, Kojiro F. (2003) Sn-Ag Based Solders Bonded to Ni-P/Au Plating: Effects of Interfacial Structure on Joint Strength. MATERIALS TRANSACTIONS, 44 (11). 2375-2383 doi:10.2320/matertrans.44.2375
Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734
Uenishi, Keisuke, Saeki, Toshio, Kohara, Yasuhiro, Kobayashi, Kojiro F., Shoji, Ikuo, Nishiura, Masataka, Yamamoto, Masaharu (2001) Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads. MATERIALS TRANSACTIONS, 42 (5). 756-760 doi:10.2320/matertrans.42.756
Hirose, Akio, Abotani, Kazuhiro, Kobayashi, Kojiro F. (2001) In-Situ Formation of Nitride Particle Reinforced Titanium Aluminide by Reactive Plasma Arc Melting Process. MATERIALS TRANSACTIONS, 42 (2). 245-251 doi:10.2320/matertrans.42.245
Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282
Ide, Eiichi, Hirose, Akio, Kobayashi, Kojiro F. (2006) Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging. MATERIALS TRANSACTIONS, 47 (1). 211-217 doi:10.2320/matertrans.47.211
Nishiura, Masataka, Nakayama, Akihiro, Sakatani, Sigeaki, Kohara, Yasuhiro, Uenishi, Keisuke, Kobayashi, Kojiro F. (2002) Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders. MATERIALS TRANSACTIONS, 43 (8). 1802-1807 doi:10.2320/matertrans.43.1802
Hirose, Akio, Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, Kobayashi, Kojiro F. (2006) Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization. Materials Science Forum, 512. 355-360 doi:10.4028/www.scientific.net/msf.512.355
Uenishi, Keisuke, Kohara, Yasuhiro, Sakatani, Shigeaki, Saeki, Toshio, Kobayashi, Kojiro F., Yamamoto, Masaharu (2002) Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball. MATERIALS TRANSACTIONS, 43 (8). 1833-1839 doi:10.2320/matertrans.43.1833
Yamaguchi, Atsushi, Furusawa, Akio, Nishida, Kazuto, Iwanishi, Hiroaki, Hojo, Takashi, Sogo, Yosuke, Hirose, Akio, Kobayashi, Kojiro F. (2005) Interfacial Reaction Layer and Reliability of CSP Solder Joints using Sn-8Zn-3Bi Solder and Ni/Au Plating Pad. Journal of the Japan Institute of Metals, 69 (1). 132-138 doi:10.2320/jinstmet.69.132
 
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