Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating | ||
| Journal | MATERIALS TRANSACTIONS | ||
| Authors | Sogo, Yousuke | Author | |
| Hojo, Takashi | Author | ||
| Iwanishi, Hiroaki | Author | ||
| Hirose, Akio | Author | ||
| Kobayashi, Kojiro F. | Author | ||
| Yamaguch, Atsushi | Author | ||
| Furusawa, Akio | Author | ||
| Nishida, Kazuto | Author | ||
| Year | 2004 | Volume | 45 |
| Issue | 3 | ||
| Publisher | Japan Institute of Metals | ||
| DOI | doi:10.2320/matertrans.45.734Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 7777383 | Long-form Identifier | mindat:1:5:7777383:8 |
| GUID | 0 | ||
| Full Reference | Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734 | ||
| Plain Text | Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734 | ||
| In | (2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals | ||
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