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Kago, Keitaro, Suetsugu, Kenichiro, Hibino, Shunji, Ikari, Takashi, Furusawa, Akio, Takano, Hiroaki, Horiuchi, Toshihisa, Ishida, Kenji, Sakaguchi, Takuma, Kikuchi, Shiomi, Matsushige, Kazumi (2004) Novel Ultrasonic Soldering Technique for Lead-Free Solders. MATERIALS TRANSACTIONS, 45 (3). 703-709 doi:10.2320/matertrans.45.703

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Reference TypeJournal (article/letter/editorial)
TitleNovel Ultrasonic Soldering Technique for Lead-Free Solders
JournalMATERIALS TRANSACTIONS
AuthorsKago, KeitaroAuthor
Suetsugu, KenichiroAuthor
Hibino, ShunjiAuthor
Ikari, TakashiAuthor
Furusawa, AkioAuthor
Takano, HiroakiAuthor
Horiuchi, ToshihisaAuthor
Ishida, KenjiAuthor
Sakaguchi, TakumaAuthor
Kikuchi, ShiomiAuthor
Matsushige, KazumiAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.703Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777378Long-form Identifiermindat:1:5:7777378:6
GUID0
Full ReferenceKago, Keitaro, Suetsugu, Kenichiro, Hibino, Shunji, Ikari, Takashi, Furusawa, Akio, Takano, Hiroaki, Horiuchi, Toshihisa, Ishida, Kenji, Sakaguchi, Takuma, Kikuchi, Shiomi, Matsushige, Kazumi (2004) Novel Ultrasonic Soldering Technique for Lead-Free Solders. MATERIALS TRANSACTIONS, 45 (3). 703-709 doi:10.2320/matertrans.45.703
Plain TextKago, Keitaro, Suetsugu, Kenichiro, Hibino, Shunji, Ikari, Takashi, Furusawa, Akio, Takano, Hiroaki, Horiuchi, Toshihisa, Ishida, Kenji, Sakaguchi, Takuma, Kikuchi, Shiomi, Matsushige, Kazumi (2004) Novel Ultrasonic Soldering Technique for Lead-Free Solders. MATERIALS TRANSACTIONS, 45 (3). 703-709 doi:10.2320/matertrans.45.703
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Suetsugu, Kenichiro, Furusawa, Akio, Tanaka, Masato, Takano, Hiroaki, Takehara, Hideki, Horiuchi, Toshihiro, Matsushige, Kazumi (2006) Liquidus Temperature Design of Lead-Free Solder. MATERIALS TRANSACTIONS, 47 (4). 1082-1089 doi:10.2320/matertrans.47.1082
Suetsugu, Kenichiro, Yamaguchi, Atsushi, Matsushige, Kazumi, Horiuchi, Toshihisa (2009) Non-Equilibrium Thermodynamic Theory of 4-Component Lead-Free Solder. MATERIALS TRANSACTIONS, 50 (2). 236-244 doi:10.2320/matertrans.mra2008094
Okumura, Tomohiro, Saitoh, Mitsuo, Nishikawa, Kazutaka, Furusawa, Akio, Suetsugu, Kenichiro (2006) Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand. MATERIALS TRANSACTIONS, 47 (3). 941-947 doi:10.2320/matertrans.47.941
Kikuchi, S, Nishimura, M, Suetsugu, K, Ikari, T, Matsushige, K (2001) Strength of bonding interface in lead-free Sn alloy solders. Materials Science and Engineering: A, 319. 475-479 doi:10.1016/s0921-5093(01)01031-0
Okumura, Tomohiro, Saitoh, Mitsuo, Nishikawa, Kazutaka, Furusawa, Akio, Suetsugu, Kenichiro (2007) Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand. Journal of the Japan Institute of Metals, 71 (2). 304-311 doi:10.2320/jinstmet.71.304
Miyazaki, Takashi, Kobayashi, Kei, Ishida, Kenji, Hotta, Shu, Horiuchi, Toshihisa, Yamada, Hirofumi, Matsushige, Kazumi (2003) Fabrication of Nanogap Electrodes Using Ultrathin Metal Film. Japanese Journal of Applied Physics, 42. 4173-4176 doi:10.1143/jjap.42.4173
Vaynman, S., Ghosh, G., Fine, M.E. (2004) Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging. MATERIALS TRANSACTIONS, 45 (3). 630-636 doi:10.2320/matertrans.45.630
Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734
Kuwajima, Shuichiro, Horie, Satoshi, Horiuchi, Toshihisa, Yamada, Hirofumi, Matsushige, Kazumi, Ishida, Kenji (2009) Crystal and Layer Structures of Ferroelectric Oligomer Thin Films. Macromolecules, 42. 3353-3357 doi:10.1021/ma802639r
Kimura, Kuniko, Kobayashi, Kei, Yamada, Hirofumi, Horiuchi, Toshihisa, Ishida, Kenji, Matsushige, Kazumi (2004) Orientation Control of High-Density Polyethylene Molecular Chains Using Atomic Force Microscope. Japanese Journal of Applied Physics, 43. doi:10.1143/jjap.43.l1390
Nishida, Takashi, Ishida, Kenji, Horiuchi, Toshihisa, Shiosaki, Tadashi, Matsushige, Kazumi (1996) In-plane Observations of RF-sputtered LiNbO 3 Thin Films Using an Energy Dispersive Total-Reflection X-Ray Diffractometer*1. Japanese Journal of Applied Physics, 35. doi:10.1143/jjap.35.l1699
 
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