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Vaynman, S., Ghosh, G., Fine, M.E. (2004) Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging. MATERIALS TRANSACTIONS, 45 (3). 630-636 doi:10.2320/matertrans.45.630

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Reference TypeJournal (article/letter/editorial)
TitleSome Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging
JournalMATERIALS TRANSACTIONS
AuthorsVaynman, S.Author
Ghosh, G.Author
Fine, M.E.Author
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.630Search in ResearchGate
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Mindat Ref. ID7777368Long-form Identifiermindat:1:5:7777368:9
GUID0
Full ReferenceVaynman, S., Ghosh, G., Fine, M.E. (2004) Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging. MATERIALS TRANSACTIONS, 45 (3). 630-636 doi:10.2320/matertrans.45.630
Plain TextVaynman, S., Ghosh, G., Fine, M.E. (2004) Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging. MATERIALS TRANSACTIONS, 45 (3). 630-636 doi:10.2320/matertrans.45.630
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, Jeon, Hyo-Joeng (2004) Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM. MATERIALS TRANSACTIONS, 45 (3). 721-726 doi:10.2320/matertrans.45.721
Huang, Chia-Wei, Lin, Kwang-Lung (2004) Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer. MATERIALS TRANSACTIONS, 45 (2). 588-594 doi:10.2320/matertrans.45.588
Kago, Keitaro, Suetsugu, Kenichiro, Hibino, Shunji, Ikari, Takashi, Furusawa, Akio, Takano, Hiroaki, Horiuchi, Toshihisa, Ishida, Kenji, Sakaguchi, Takuma, Kikuchi, Shiomi, Matsushige, Kazumi (2004) Novel Ultrasonic Soldering Technique for Lead-Free Solders. MATERIALS TRANSACTIONS, 45 (3). 703-709 doi:10.2320/matertrans.45.703
Wang, Xi, Zhang, Liang, Li, Mu-lan (2022) Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging. MATERIALS TRANSACTIONS, 63 (2) 93-104 doi:10.2320/matertrans.mt-m2021200
Kim, Yule, Bae, Donghyun (2004) Superplasticity in a Fine-Grained Mg—Zn—Y—Zr Alloy Containing Quasicrystalline Particles. MATERIALS TRANSACTIONS, 45 (12). 3298-3303 doi:10.2320/matertrans.45.3298
Lee, Joo Won, Lee, Zin Hyoung, Lee, Hyuck Mo (2005) Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders. MATERIALS TRANSACTIONS, 46 (11). 2344-2350 doi:10.2320/matertrans.46.2344
Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Ono, Katsutoshi (2004) Fundamental Aspects of Calciothermic Process to Produce Titanium. MATERIALS TRANSACTIONS, 45 (5). 1660-1664 doi:10.2320/matertrans.45.1660
Takemoto, Tadashi, Miyazaki, Makoto (2001) Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test. MATERIALS TRANSACTIONS, 42 (5). 745-750 doi:10.2320/matertrans.42.745
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
 
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