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Huang, Chia-Wei, Lin, Kwang-Lung (2004) Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer. MATERIALS TRANSACTIONS, 45 (2). 588-594 doi:10.2320/matertrans.45.588

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Reference TypeJournal (article/letter/editorial)
TitleWetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
JournalMATERIALS TRANSACTIONS
AuthorsHuang, Chia-WeiAuthor
Lin, Kwang-LungAuthor
Year2004Volume45
Issue2
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.588Search in ResearchGate
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Mindat Ref. ID7777360Long-form Identifiermindat:1:5:7777360:7
GUID0
Full ReferenceHuang, Chia-Wei, Lin, Kwang-Lung (2004) Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer. MATERIALS TRANSACTIONS, 45 (2). 588-594 doi:10.2320/matertrans.45.588
Plain TextHuang, Chia-Wei, Lin, Kwang-Lung (2004) Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer. MATERIALS TRANSACTIONS, 45 (2). 588-594 doi:10.2320/matertrans.45.588
In(2004) MATERIALS TRANSACTIONS Vol. 45 (2) Japan Institute of Metals

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Huang, Chia-Wei, Lin, Kwang-Lung (2004) Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. Journal of Materials Research, 19 (12) 3560-3568 doi:10.1557/jmr.2004.0458
Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, Jeon, Hyo-Joeng (2004) Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM. MATERIALS TRANSACTIONS, 45 (3). 721-726 doi:10.2320/matertrans.45.721
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1887-1890 doi:10.2320/matertrans.43.1887
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1840-1846 doi:10.2320/matertrans.43.1840
Song, Jenn-Ming, Liu, Nai-Shuo, Lin, Kwang-Lung (2004) Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys. MATERIALS TRANSACTIONS, 45 (3). 776-782 doi:10.2320/matertrans.45.776
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Wang, Chao-hong, Wen, Chun-chieh, Lin, Che-yang (2016) Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate. Journal of Alloys and Compounds, 662. 475-483 doi:10.1016/j.jallcom.2015.12.060
Takaku, Yoshikazu, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, Ishida, Kiyohito (2004) Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate. MATERIALS TRANSACTIONS, 45 (3). 646-651 doi:10.2320/matertrans.45.646
Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, Jung, In-Ok, Kim, Heon-Hee (2004) Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad. Journal of Alloys and Compounds, 379. 314-318 doi:10.1016/j.jallcom.2004.03.138
Cheng, Shou Chang, Lin, Kwang Lung (2003) Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C. Journal of Materials Research, 18 (8) 1795-1803 doi:10.1557/jmr.2003.0249
 
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