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Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
JournalMATERIALS TRANSACTIONS
AuthorsNishikawa, HiroshiAuthor
Takemoto, TadashiAuthor
Kifune, KouichiAuthor
Uetani, TakashiAuthor
Sekimori, NorihisaAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.741Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777384Long-form Identifiermindat:1:5:7777384:7
GUID0
Full ReferenceNishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
Plain TextNishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Nishikawa, Hiroshi, Takemoto, Tadashi, Uetani, Takashi, Sekimori, Norihisa (2005) Effect of Grain Size on Reaction between Pb-Free Solder and Plated Iron. Materials Science Forum, 502. 405-410 doi:10.4028/www.scientific.net/msf.502.405
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
Jeong, Woo-Ju, Nishikawa, Hiroshi, Gotoh, Hideyuki, Takemoto, Tadashi (2005) Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive. MATERIALS TRANSACTIONS, 46 (3). 704-708 doi:10.2320/matertrans.46.704
Takemoto, Tadashi, Funaki, Tatsuya (2002) Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting. MATERIALS TRANSACTIONS, 43 (8). 1784-1790 doi:10.2320/matertrans.43.1784
Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface. MATERIALS TRANSACTIONS, 49 (7). 1518-1523 doi:10.2320/matertrans.mf200851
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder. Materials Science Forum, 580. 243-246 doi:10.4028/www.scientific.net/msf.580-582.243
Nishikawa, Hiroshi, Seo, Kouhei, Katayama, Seiji, Takemoto, Tadashi (2005) Application of Nd:YAG Laser to Aluminum Alloy Sorting. MATERIALS TRANSACTIONS, 46 (12). 2641-2646 doi:10.2320/matertrans.46.2641
Takemoto, Tadashi, Miyazaki, Makoto (2001) Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test. MATERIALS TRANSACTIONS, 42 (5). 745-750 doi:10.2320/matertrans.42.745
Nishikawa, Hiroshi, WongPiromsarn, Krit, Abe, Hiroya, Takemoto, Tadashi, Fukuhara, Mikio, Inoue, Akihisa (2009) Solderability of Bulk Metallic Glasses Using Lead-Free Solders. MATERIALS TRANSACTIONS, 50 (6). 1326-1329 doi:10.2320/matertrans.me200824
 
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