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Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754

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Reference TypeJournal (article/letter/editorial)
TitleGrowth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
JournalMATERIALS TRANSACTIONS
AuthorsShohji, IkuoAuthor
Shiratori, YujiAuthor
Yoshida, HiroshiAuthor
Mizukami, MasahikoAuthor
Ichida, AkiraAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.754Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777386Long-form Identifiermindat:1:5:7777386:5
GUID0
Full ReferenceShohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
Plain TextShohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

See Also

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Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Shohji, Ikuo, Nakamura, Takao, Mori, Fuminari, Fujiuchi, Shinichi (2002) Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints. MATERIALS TRANSACTIONS, 43 (8). 1797-1801 doi:10.2320/matertrans.43.1797
Chen, Sinn-wen, Lin, Shih-kang, Jao, Jui-meng (2004) Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints. MATERIALS TRANSACTIONS, 45 (3). 661-665 doi:10.2320/matertrans.45.661
Nakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730
Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Hata, Hanae, Maruya, Yuuki, Shohji, Ikuo (2016) Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization. MATERIALS TRANSACTIONS, 57 (6). 887-891 doi:10.2320/matertrans.md201514
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint. MATERIALS TRANSACTIONS, 46 (12). 2725-2729 doi:10.2320/matertrans.46.2725
Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, Hioki, Susumu (2002) Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders. MATERIALS TRANSACTIONS, 43 (8). 1854-1857 doi:10.2320/matertrans.43.1854
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
 
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