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Chen, Sinn-wen, Lin, Shih-kang, Jao, Jui-meng (2004) Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints. MATERIALS TRANSACTIONS, 45 (3). 661-665 doi:10.2320/matertrans.45.661

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Reference TypeJournal (article/letter/editorial)
TitleElectromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
JournalMATERIALS TRANSACTIONS
AuthorsChen, Sinn-wenAuthor
Lin, Shih-kangAuthor
Jao, Jui-mengAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.661Search in ResearchGate
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Mindat Ref. ID7777372Long-form Identifiermindat:1:5:7777372:2
GUID0
Full ReferenceChen, Sinn-wen, Lin, Shih-kang, Jao, Jui-meng (2004) Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints. MATERIALS TRANSACTIONS, 45 (3). 661-665 doi:10.2320/matertrans.45.661
Plain TextChen, Sinn-wen, Lin, Shih-kang, Jao, Jui-meng (2004) Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints. MATERIALS TRANSACTIONS, 45 (3). 661-665 doi:10.2320/matertrans.45.661
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
Lin, Shih-Kang, Chang, Ru-Bo, Chen, Sinn-Wen, Tsai, Ming-Yueh, Hsu, Chia-Ming (2014) Effects of zinc on the interfacial reactions of tin–indium solder joints with copper. Journal of Materials Science, 49. 3805-3815 doi:10.1007/s10853-014-8092-8
Chen, Sinn-Wen, Wang, Chao-Hong (2007) Effects of electromigration on interfacial reactions in cast Sn/Cu joints. Journal of Materials Research, 22 (3) 695-702 doi:10.1557/jmr.2007.0093
HUANG, Mingliang, CHEN, Leida, ZHOU, Shaoming (2012) EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS. ACTA METALLURGICA SINICA, 48 (3). 321pp. doi:10.3724/sp.j.1037.2011.00601
Chen, Chih-ming, Chen, Sinn-wen (2003) Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. Journal of Materials Research, 18 (6) 1293-1296 doi:10.1557/jmr.2003.0177
Chen, Sinn-wen, Lin, Shih-kang (2006) Effects of temperature on interfacial reactions in γ–InSn4/Ni couples. Journal of Materials Research, 21 (5) 1161-1166 doi:10.1557/jmr.2006.0137
Terashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681
Hong, Soon-Min, Kang, Choon-Sik, Jung, Jae-Pil (2002) Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave. MATERIALS TRANSACTIONS, 43 (6). 1336-1340 doi:10.2320/matertrans.43.1336
Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions. Journal of Applied Physics, 103 (6). 63518pp. doi:10.1063/1.2899956
Lin, Y.H., Tsai, C.M., Hu, Y.C., Lin, Y.L., Tsai, J.Y., Kao, C.R. (2005) Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints. Materials Science Forum, 475. 2655-2658 doi:10.4028/www.scientific.net/msf.475-479.2655
Kim, Dae-Gon, Jung, Seung-Boo (2005) Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy. MATERIALS TRANSACTIONS, 46 (6). 1295-1300 doi:10.2320/matertrans.46.1295
 
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