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Nakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730

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Reference TypeJournal (article/letter/editorial)
TitleComparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
JournalMATERIALS TRANSACTIONS
AuthorsNakamura, KiyotomoAuthor
Shohji, IkuoAuthor
Goto, HirokiAuthor
Ookubo, ToshikazuAuthor
Year2005Volume46
Issue12
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2730Search in ResearchGate
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Mindat Ref. ID7777905Long-form Identifiermindat:1:5:7777905:4
GUID0
Full ReferenceNakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730
Plain TextNakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730
In(2005) MATERIALS TRANSACTIONS Vol. 46 (12) Japan Institute of Metals

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Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint. MATERIALS TRANSACTIONS, 46 (12). 2725-2729 doi:10.2320/matertrans.46.2725
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu. Key Engineering Materials, 297. 2864-2869 doi:10.4028/www.scientific.net/kem.297-300.2864
Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Shohji, Ikuo, Nakamura, Takao, Mori, Fuminari, Fujiuchi, Shinichi (2002) Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints. MATERIALS TRANSACTIONS, 43 (8). 1797-1801 doi:10.2320/matertrans.43.1797
Watanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Golberg, Dmitri, Shohji, Ikuo (2022) Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 63 (8) 1112-1119 doi:10.2320/matertrans.mt-mc2022010
Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
TSUCHIDA, Tetsuyuki, OKUBO, Toshikazu, KANO, Takahiro, SHOHJI, Ikuo (2013) The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint. Journal of Smart Processing, 2 (1). 22-25 doi:10.7791/jspmee.2.22
Hamasaki, Hiroshi, Shinbata, Kazuhiro, Yoshida, Fusahito (2005) Identification of Viscoplastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation. MATERIALS TRANSACTIONS, 46 (12). 3073-3076 doi:10.2320/matertrans.46.3073
Watanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Shohji, Ikuo (2019) Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder. Applied Sciences, 9. 2724pp. doi:10.3390/app9132724
Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
 
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