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Hamasaki, Hiroshi, Shinbata, Kazuhiro, Yoshida, Fusahito (2005) Identification of Viscoplastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation. MATERIALS TRANSACTIONS, 46 (12). 3073-3076 doi:10.2320/matertrans.46.3073

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Reference TypeJournal (article/letter/editorial)
TitleIdentification of Viscoplastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation
JournalMATERIALS TRANSACTIONS
AuthorsHamasaki, HiroshiAuthor
Shinbata, KazuhiroAuthor
Yoshida, FusahitoAuthor
Year2005Volume46
Issue12
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.3073Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777961Long-form Identifiermindat:1:5:7777961:0
GUID0
Full ReferenceHamasaki, Hiroshi, Shinbata, Kazuhiro, Yoshida, Fusahito (2005) Identification of Viscoplastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation. MATERIALS TRANSACTIONS, 46 (12). 3073-3076 doi:10.2320/matertrans.46.3073
Plain TextHamasaki, Hiroshi, Shinbata, Kazuhiro, Yoshida, Fusahito (2005) Identification of Viscoplastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation. MATERIALS TRANSACTIONS, 46 (12). 3073-3076 doi:10.2320/matertrans.46.3073
In(2005) MATERIALS TRANSACTIONS Vol. 46 (12) Japan Institute of Metals

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Hamasaki, Hiroshi, Shinbata, Kazuhiro, Yoshida, Fusahito (2008) Viscoplastic Parameter Identification for Lead-Free Solder Alloy by Micro-Indentation, FE Simulation and Optimization. MATERIALS TRANSACTIONS, 49 (3). 532-537 doi:10.2320/matertrans.p-mra2007887
Ma, Xin, Yoshida, Fusahito, Shinbata, Kazuhiro (2003) On the loading curve in microindentation of viscoplastic solder alloy. Materials Science and Engineering: A, 344. 296-299 doi:10.1016/s0921-5093(02)00442-2
Nakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730
Hamasaki, H., Yoshida, Fusahito (2006) Identification of Plasticity Parameters of Metallic Coatings by Means of Depth-Sensing Micro-Indentation. Materials Science Forum, 505. 757-762 doi:10.4028/www.scientific.net/msf.505-507.757
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint. MATERIALS TRANSACTIONS, 46 (12). 2725-2729 doi:10.2320/matertrans.46.2725
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
Tamura, Shohei, Sumikawa, Satoshi, Uemori, Takeshi, Hamasaki, Hiroshi, Yoshida, Fusahito (2011) Experimental Observation of Elasto-Plasticity Behavior of Type 5000 and 6000 Aluminum Alloy Sheets. MATERIALS TRANSACTIONS, 52 (5). 868-875 doi:10.2320/matertrans.l-mz201101
Nakano, Atsushi, Rochman, Nurul Taufiqu, Sueyoshi, Hidekazu (2005) Removal of Lead from Copper Alloy Scraps by Compound-Separation Method. MATERIALS TRANSACTIONS, 46 (12). 2719-2724 doi:10.2320/matertrans.46.2719
Nakano, Atsushi, Rochman, Nurul Taufiqu, Sueyoshi, Hidekazu (2005) LCA of Manufacturing Lead-Free Copper Alloys. MATERIALS TRANSACTIONS, 46 (12). 2713-2718 doi:10.2320/matertrans.46.2713
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi (2005) Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. MATERIALS TRANSACTIONS, 46 (11). 2413-2418 doi:10.2320/matertrans.46.2413
 
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