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Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial Reaction between Sn–Ag–Co Solder and Metals
JournalMATERIALS TRANSACTIONS
AuthorsNishikawa, HiroshiAuthor
Komatsu, AkiraAuthor
Takemoto, TadashiAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2394Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777845Long-form Identifiermindat:1:5:7777845:3
GUID0
Full ReferenceNishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
Plain TextNishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

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Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface. MATERIALS TRANSACTIONS, 49 (7). 1518-1523 doi:10.2320/matertrans.mf200851
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder. Materials Science Forum, 580. 243-246 doi:10.4028/www.scientific.net/msf.580-582.243
Wang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo (2005) Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. MATERIALS TRANSACTIONS, 46 (11). 2431-2436 doi:10.2320/matertrans.46.2431
Ishikawa, Shinji, Hashino, Eiji, Kono, Taro, Tatsumi, Kohei (2005) IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging. MATERIALS TRANSACTIONS, 46 (11). 2351-2358 doi:10.2320/matertrans.46.2351
Yamamoto, Takashi, Sakatani, Shigeaki, Kobayashi, Shinji, Uenishi, Keisuke, Kobayashi, Kojiro F., Ishio, Masaaki, Shiomi, Kazuhiro, Hashimoto, Akio, Yamamoto, Masaharu (2005) Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases. MATERIALS TRANSACTIONS, 46 (11). 2406-2412 doi:10.2320/matertrans.46.2406
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2005) Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging. MATERIALS TRANSACTIONS, 46 (11). 2386-2393 doi:10.2320/matertrans.46.2386
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Takenaka, Toshio, Kano, Satoru, Kajihara, Masanori, Kurokawa, Noriharu, Sakamoto, Katsuhiko (2005) Growth Behavior of Au–Sn and Ag–Sn Compounds during Solid-state Reactive Diffusion between Au–Ag Alloys and Sn. MATERIALS TRANSACTIONS, 46 (8). 1825-1832 doi:10.2320/matertrans.46.1825
Lee, Jaesik, Jung, Jae-Pil, Cheon, Chu-Seon, Zhou, Yunhong, Mayer, Michael (2005) Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing. MATERIALS TRANSACTIONS, 46 (11). 2359-2365 doi:10.2320/matertrans.46.2359
 
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