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Wang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo (2005) Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. MATERIALS TRANSACTIONS, 46 (11). 2431-2436 doi:10.2320/matertrans.46.2431

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Reference TypeJournal (article/letter/editorial)
TitleStudy on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
JournalMATERIALS TRANSACTIONS
AuthorsWang, Ying-HuiAuthor
Howlader, Matiar RAuthor
Nishida, KenjiAuthor
Kimura, TakashiAuthor
Suga, TadatomoAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2431Search in ResearchGate
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Mindat Ref. ID7777851Long-form Identifiermindat:1:5:7777851:4
GUID0
Full ReferenceWang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo (2005) Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. MATERIALS TRANSACTIONS, 46 (11). 2431-2436 doi:10.2320/matertrans.46.2431
Plain TextWang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo (2005) Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. MATERIALS TRANSACTIONS, 46 (11). 2431-2436 doi:10.2320/matertrans.46.2431
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

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Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa (2005) Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen. MATERIALS TRANSACTIONS, 46 (11). 2309-2315 doi:10.2320/matertrans.46.2309
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Takenaka, Toshio, Kano, Satoru, Kajihara, Masanori, Kurokawa, Noriharu, Sakamoto, Katsuhiko (2005) Growth Behavior of Au–Sn and Ag–Sn Compounds during Solid-state Reactive Diffusion between Au–Ag Alloys and Sn. MATERIALS TRANSACTIONS, 46 (8). 1825-1832 doi:10.2320/matertrans.46.1825
Zhang, Xiaorui, Matsuura, Hiroyuki, Tsukihashi, Fumitaka, Yuan, Zhangfu (2012) Wettability of Sn–Zn, Sn–Ag–Cu and Sn–Bi–Cu Alloys on Copper Substrates. MATERIALS TRANSACTIONS, 53 (5). 926-931 doi:10.2320/matertrans.m2011349
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Men, Hua, Zhang, Tao (2005) A Bulk Glassy Cu–Zr–Ti–Sn Alloy with Superior Plasticity. MATERIALS TRANSACTIONS, 46 (11). 2545-2547 doi:10.2320/matertrans.46.2545
Yamamoto, Takashi, Sakatani, Shigeaki, Kobayashi, Shinji, Uenishi, Keisuke, Kobayashi, Kojiro F., Ishio, Masaaki, Shiomi, Kazuhiro, Hashimoto, Akio, Yamamoto, Masaharu (2005) Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases. MATERIALS TRANSACTIONS, 46 (11). 2406-2412 doi:10.2320/matertrans.46.2406
Ono-Nakazato, Hideki, Taguchi, Kenji, Kawauchi, Daisuke, Usui, Tateo (2006) Separation of Fe and Sn–Cu Phases in an Fe–Sn–Cu–B System. MATERIALS TRANSACTIONS, 47 (3). 864-867 doi:10.2320/matertrans.47.864
Men, Hua, Zhang, Tao (2005) Glass Formation and Thermal Stability of Bulk Glassy Cu–Zr–Ti–Sn–Si Alloys. MATERIALS TRANSACTIONS, 46 (7). 1692-1694 doi:10.2320/matertrans.46.1692
 
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