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Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu (2002) Influence of Soldering Conditions on Void Formation in Large-area Solder Joints. MATERIALS TRANSACTIONS, 43 (7). 1774-1777 doi:10.2320/matertrans.43.1774

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Reference TypeJournal (article/letter/editorial)
TitleInfluence of Soldering Conditions on Void Formation in Large-area Solder Joints
JournalMATERIALS TRANSACTIONS
AuthorsOnuki, JinAuthor
Chonan, YasunoriAuthor
Komiyama, TakaoAuthor
Nihei, MasayasuAuthor
Year2002Volume43
Issue7
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.43.1774Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7776607Long-form Identifiermindat:1:5:7776607:8
GUID0
Full ReferenceOnuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu (2002) Influence of Soldering Conditions on Void Formation in Large-area Solder Joints. MATERIALS TRANSACTIONS, 43 (7). 1774-1777 doi:10.2320/matertrans.43.1774
Plain TextOnuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu (2002) Influence of Soldering Conditions on Void Formation in Large-area Solder Joints. MATERIALS TRANSACTIONS, 43 (7). 1774-1777 doi:10.2320/matertrans.43.1774
In(2002) MATERIALS TRANSACTIONS Vol. 43 (7) Japan Institute of Metals

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Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu, Suwa, Masateru, Kitano, Makoto (2001) Reliability Enhancement of Solder Joints Made by a Void Free Soldering Process. MATERIALS TRANSACTIONS, 42 (5). 890-893 doi:10.2320/matertrans.42.890
Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Ohta, Toshihiko (2002) The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (2). 227-231 doi:10.2320/matertrans.43.227
Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu, Saitou, Ryuuichi, Suwa, Masateru, Morita, Toshiaki (2001) A Void Free Soldering Process in Large-Area, High Power Insulated Gate Bipolar Transistor Modules. Japanese Journal of Applied Physics, 40. 3985-3991 doi:10.1143/jjap.40.3985
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin (2001) Interface Reaction between Solder and Plated Nickel Film. MATERIALS TRANSACTIONS, 42 (4). 697-701 doi:10.2320/matertrans.42.697
Onuki, Jin, Komiyama, Takao, Chonan, Yasunori, Koizumi, Masahiro (2002) High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire. MATERIALS TRANSACTIONS, 43 (8). 2157-2160 doi:10.2320/matertrans.43.2157
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1840-1846 doi:10.2320/matertrans.43.1840
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1887-1890 doi:10.2320/matertrans.43.1887
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Nagano, Takahiro, Akahoshi, Haruo, Itabashi, Takeyuki, Saito, Tatuyuki, Khoo, Khyoupin (2006) Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating. MATERIALS TRANSACTIONS, 47 (5). 1417-1419 doi:10.2320/matertrans.47.1417
Onuki, Jin, Nihei, Masayasu, Funamoto, Takao, Doi, Hiroyuki, Fukui, Yutaka (2001) Joining of Oxide Dispersion Strengthened Ni Based Super Alloys. MATERIALS TRANSACTIONS, 42 (2). 365-371 doi:10.2320/matertrans.42.365
Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke (2007) Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects. MATERIALS TRANSACTIONS, 48 (3). 622-624 doi:10.2320/matertrans.48.622
Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Koizumi, Masahiko, Shigemura, Tatsuya (2002) High-Temperature Thick Al Wire Bonding Technology for High-Power Modules. Japanese Journal of Applied Physics, 41. 5030-5033 doi:10.1143/jjap.41.5030
 
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