Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Koizumi, Masahiko, Shigemura, Tatsuya (2002) High-Temperature Thick Al Wire Bonding Technology for High-Power Modules. Japanese Journal of Applied Physics, 41. 5030-5033 doi:10.1143/jjap.41.5030
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | High-Temperature Thick Al Wire Bonding Technology for High-Power Modules | ||
| Journal | Japanese Journal of Applied Physics | ||
| Authors | Komiyama, Takao | Author | |
| Chonan, Yasunori | Author | ||
| Onuki, Jin | Author | ||
| Koizumi, Masahiko | Author | ||
| Shigemura, Tatsuya | Author | ||
| Year | 2002 (August 15) | Volume | 41 |
| Publisher | Japan Society of Applied Physics | ||
| DOI | doi:10.1143/jjap.41.5030Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 15018498 | Long-form Identifier | mindat:1:5:15018498:2 |
| GUID | 0 | ||
| Full Reference | Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Koizumi, Masahiko, Shigemura, Tatsuya (2002) High-Temperature Thick Al Wire Bonding Technology for High-Power Modules. Japanese Journal of Applied Physics, 41. 5030-5033 doi:10.1143/jjap.41.5030 | ||
| Plain Text | Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Koizumi, Masahiko, Shigemura, Tatsuya (2002) High-Temperature Thick Al Wire Bonding Technology for High-Power Modules. Japanese Journal of Applied Physics, 41. 5030-5033 doi:10.1143/jjap.41.5030 | ||
| In | (2002) Japanese Journal of Applied Physics Vol. 41. Japan Society of Applied Physics | ||
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