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Shohji, Ikuo, Kawabata, Yoshinori, Kimura, Yoshitaka (2003) Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni. MATERIALS TRANSACTIONS, 44 (5). 866-869 doi:10.2320/matertrans.44.866

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
JournalMATERIALS TRANSACTIONS
AuthorsShohji, IkuoAuthor
Kawabata, YoshinoriAuthor
Kimura, YoshitakaAuthor
Year2003Volume44
Issue5
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.44.866Search in ResearchGate
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Mindat Ref. ID7777005Long-form Identifiermindat:1:5:7777005:3
GUID0
Full ReferenceShohji, Ikuo, Kawabata, Yoshinori, Kimura, Yoshitaka (2003) Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni. MATERIALS TRANSACTIONS, 44 (5). 866-869 doi:10.2320/matertrans.44.866
Plain TextShohji, Ikuo, Kawabata, Yoshinori, Kimura, Yoshitaka (2003) Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni. MATERIALS TRANSACTIONS, 44 (5). 866-869 doi:10.2320/matertrans.44.866
In(2003) MATERIALS TRANSACTIONS Vol. 44 (5) Japan Institute of Metals

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Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Kim, Jin-Hak, Tabaru, Tatsuo, Hirai, Hisatoshi (2003) Evaluation Technique of the Hardness and Elastic Modulus of Materials with Fine Microstructures. MATERIALS TRANSACTIONS, 44 (4). 673-676 doi:10.2320/matertrans.44.673
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Saito, Tetsuji (2003) Microstructures and Magnetic Properties of Co-Zr System Alloys. MATERIALS TRANSACTIONS, 44 (9). 1713-1716 doi:10.2320/matertrans.44.1713
Barnett, Matthew Robert (2003) Quenched and Annealed Microstructures of Hot Worked Magnesium AZ31. MATERIALS TRANSACTIONS, 44 (4). 571-577 doi:10.2320/matertrans.44.571
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Hata, Hanae, Maruya, Yuuki, Shohji, Ikuo (2016) Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization. MATERIALS TRANSACTIONS, 57 (6). 887-891 doi:10.2320/matertrans.md201514
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Yamaura, Shin-ichi, Kimura, Hisamichi, Inoue, Akihisa (2003) Hydrogen Absorption of Oxide Composite Materials Prepared from Melt-Spun Zr-Pd-Ni Alloys. MATERIALS TRANSACTIONS, 44 (4). 696-699 doi:10.2320/matertrans.44.696
Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, Hioki, Susumu (2002) Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders. MATERIALS TRANSACTIONS, 43 (8). 1854-1857 doi:10.2320/matertrans.43.1854
Koyama, Shinji, Oya, Issei, Shohji, Ikuo (2016) Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler. MATERIALS TRANSACTIONS, 57 (6). 810-814 doi:10.2320/matertrans.md201507
 
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