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Kim, Jae Hyung, Lee, Jung Hee, Kim, Jong Min, Lee, Seong Hyuk (2009) Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model. MATERIALS TRANSACTIONS, 50 (7). 1678-1683 doi:10.2320/matertrans.mf200915

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Reference TypeJournal (article/letter/editorial)
TitleNumerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model
JournalMATERIALS TRANSACTIONS
AuthorsKim, Jae HyungAuthor
Lee, Jung HeeAuthor
Kim, Jong MinAuthor
Lee, Seong HyukAuthor
Year2009Volume50
Issue7
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.mf200915Search in ResearchGate
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Mindat Ref. ID7780356Long-form Identifiermindat:1:5:7780356:4
GUID0
Full ReferenceKim, Jae Hyung, Lee, Jung Hee, Kim, Jong Min, Lee, Seong Hyuk (2009) Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model. MATERIALS TRANSACTIONS, 50 (7). 1678-1683 doi:10.2320/matertrans.mf200915
Plain TextKim, Jae Hyung, Lee, Jung Hee, Kim, Jong Min, Lee, Seong Hyuk (2009) Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model. MATERIALS TRANSACTIONS, 50 (7). 1678-1683 doi:10.2320/matertrans.mf200915
In(2009) MATERIALS TRANSACTIONS Vol. 50 (7) Japan Institute of Metals

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Lee, Jin Woon, Lee, Seong Hyuk, Kim, Jong-Min, Kim, Jae Hyung, Lee, Jung Hee (2008) Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler. MATERIALS TRANSACTIONS, 49 (11). 2572-2578 doi:10.2320/matertrans.mb200819
Yim, Byung-Seung, Kim, Jong-Min, Jeon, Sung-Ho, Lee, Seong Hyuk, Kim, Jooheon, Han, Jung-Geun, Cho, Minhaeng (2009) Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers. MATERIALS TRANSACTIONS, 50 (11). 2649-2655 doi:10.2320/matertrans.m2009109
Yim, Byung-Seung, Lee, Jeong Il, Heo, Yuseon, Kim, Jooheon, Lee, Seong Hyuk, Shin, Young-Eui, Kim, Jong-Min (2012) Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers. MATERIALS TRANSACTIONS, 53 (12). 2104-2110 doi:10.2320/matertrans.mb201207
Lee, Seong Hyuk, Lee, Jung Hee, Lee, Jin Woon, Kim, Jong Min (2008) Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs). Materials Science Forum, 580. 213-216 doi:10.4028/www.scientific.net/msf.580-582.213
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Yim, Byung-Seung, Kim, Jong-Min, Jeon, Sung-Ho, Lee, Seong Hyuk, Kim, Jooheon, Han, Jung-Geun, Eom, Yong-Sung, Shin, Young-Eui (2009) Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive). MATERIALS TRANSACTIONS, 50 (7). 1684-1689 doi:10.2320/matertrans.mf200918
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Yim, Byung-Seung, Lee, Jae Woo, Kim, Jong-Min (2020) Conduction Path Formation Mechanism of Solderable Polymer Composites with Low-Melting-Point Alloy/High-Melting-Point Alloy Mixed Filler. MATERIALS TRANSACTIONS, 61 (3). 557-560 doi:10.2320/matertrans.mt-m2019285
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