Lee, Seong Hyuk, Lee, Hyung Jun, Kim, Jong-Min, Shin, Young Eui (2011) Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging. MATERIALS TRANSACTIONS, 52 (10). 1998-2003 doi:10.2320/matertrans.m2011151
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging | ||
| Journal | MATERIALS TRANSACTIONS | ||
| Authors | Lee, Seong Hyuk | Author | |
| Lee, Hyung Jun | Author | ||
| Kim, Jong-Min | Author | ||
| Shin, Young Eui | Author | ||
| Year | 2011 | Volume | 52 |
| Issue | 10 | ||
| Publisher | Japan Institute of Metals | ||
| DOI | doi:10.2320/matertrans.m2011151Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 7780909 | Long-form Identifier | mindat:1:5:7780909:0 |
| GUID | 0 | ||
| Full Reference | Lee, Seong Hyuk, Lee, Hyung Jun, Kim, Jong-Min, Shin, Young Eui (2011) Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging. MATERIALS TRANSACTIONS, 52 (10). 1998-2003 doi:10.2320/matertrans.m2011151 | ||
| Plain Text | Lee, Seong Hyuk, Lee, Hyung Jun, Kim, Jong-Min, Shin, Young Eui (2011) Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging. MATERIALS TRANSACTIONS, 52 (10). 1998-2003 doi:10.2320/matertrans.m2011151 | ||
| In | (2011) MATERIALS TRANSACTIONS Vol. 52 (10) Japan Institute of Metals | ||
See Also
These are possibly similar items as determined by title/reference text matching only.
