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Wu, Min, Li, Jinquan (2019) Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys. Philosophical Magazine, 99 (20). 2531-2544 doi:10.1080/14786435.2019.1631500

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Reference TypeJournal (article/letter/editorial)
TitleEstimation of the viscosities of melt for Sn-based ternary lead-free solder alloys
JournalPhilosophical Magazine
AuthorsWu, MinAuthor
Li, JinquanAuthor
Year2019 (October 18)Volume99
Issue20
PublisherInforma UK Limited
DOIdoi:10.1080/14786435.2019.1631500Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7881215Long-form Identifiermindat:1:5:7881215:2
GUID0
Full ReferenceWu, Min, Li, Jinquan (2019) Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys. Philosophical Magazine, 99 (20). 2531-2544 doi:10.1080/14786435.2019.1631500
Plain TextWu, Min, Li, Jinquan (2019) Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys. Philosophical Magazine, 99 (20). 2531-2544 doi:10.1080/14786435.2019.1631500
In(2019, October) Philosophical Magazine Vol. 99 (20) Informa UK Limited

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Islam, R.A., Wu, B.Y., Alam, M.O., Chan, Y.C., Jillek, W. (2005) Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder. Journal of Alloys and Compounds, 392. 149-158 doi:10.1016/j.jallcom.2004.08.079
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
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El-Daly, A.A., Swilem, Y., Hammad, A.E. (2009) Creep properties of Sn–Sb based lead-free solder alloys. Journal of Alloys and Compounds, 471. 98-104 doi:10.1016/j.jallcom.2008.03.097
Jayesh, S., Jacob, E. (2019) An Experimental Investigation on the Properties of Two Novel Ternary Solder Alloys Sn–0.5Cu–3Bi and Sn–1Cu–1Ni Replacing Lead. Physics of Metals and Metallography, 120 (13) 1398-1403 doi:10.1134/s0031918x1913009x
El-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
S, Jayesh, Elias, Jacob (2019) Experimental investigations on the effect of addition of Ag into ternary lead free solder alloy Sn-1Cu-1Ni. Letters on Materials, 9. 239-242 doi:10.22226/2410-3535-2019-2-239-242
Ogawa, Naotaka, Miki, Takahiro, Nagasaka, Tetsuya, Hino, Mitsutaka (2002) Activity Measurement of the Constituents in Molten Sn-Mg-Zn Ternary Lead Free Solder Alloys by Mass Spectrometry. MATERIALS TRANSACTIONS, 43 (12). 3227-3233 doi:10.2320/matertrans.43.3227
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