Fukushima, T., Iwata, E., Konno, T., Bea, J.-C., Lee, K.-W., Tanaka, T., Koyanagi, M. (2010) Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits. Applied Physics Letters, 96 (15). 154105pp. doi:10.1063/1.3328098
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits | ||
| Journal | Applied Physics Letters | ||
| Authors | Fukushima, T. | Author | |
| Iwata, E. | Author | ||
| Konno, T. | Author | ||
| Bea, J.-C. | Author | ||
| Lee, K.-W. | Author | ||
| Tanaka, T. | Author | ||
| Koyanagi, M. | Author | ||
| Year | 2010 (April 12) | Volume | 96 |
| Issue | 15 | ||
| Publisher | AIP Publishing | ||
| DOI | doi:10.1063/1.3328098Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 8582726 | Long-form Identifier | mindat:1:5:8582726:8 |
| GUID | 0 | ||
| Full Reference | Fukushima, T., Iwata, E., Konno, T., Bea, J.-C., Lee, K.-W., Tanaka, T., Koyanagi, M. (2010) Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits. Applied Physics Letters, 96 (15). 154105pp. doi:10.1063/1.3328098 | ||
| Plain Text | Fukushima, T., Iwata, E., Konno, T., Bea, J.-C., Lee, K.-W., Tanaka, T., Koyanagi, M. (2010) Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits. Applied Physics Letters, 96 (15). 154105pp. doi:10.1063/1.3328098 | ||
| In | (2010, April) Applied Physics Letters Vol. 96 (15) AIP Publishing | ||
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