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Wang, W.C., Kang, E.T., Neoh, K.G. (2002) Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science, 199. 52-66 doi:10.1016/s0169-4332(02)00473-7

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Reference TypeJournal (article/letter/editorial)
TitleElectroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
JournalApplied Surface Science
AuthorsWang, W.C.Author
Kang, E.T.Author
Neoh, K.G.Author
Year2002 (October)Volume199
PublisherElsevier BV
DOIdoi:10.1016/s0169-4332(02)00473-7Search in ResearchGate
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Mindat Ref. ID9904282Long-form Identifiermindat:1:5:9904282:8
GUID0
Full ReferenceWang, W.C., Kang, E.T., Neoh, K.G. (2002) Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science, 199. 52-66 doi:10.1016/s0169-4332(02)00473-7
Plain TextWang, W.C., Kang, E.T., Neoh, K.G. (2002) Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science, 199. 52-66 doi:10.1016/s0169-4332(02)00473-7
In(n.d.) Applied Surface Science Vol. 199. Elsevier BV

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Yang, G.H., Kang, E.T., Neoh, K.G. (2001) Electroless deposition of copper and nickel on poly(tetrafluoroethylene) films modified by single and double surface graft copolymerization. Applied Surface Science, 178. 165-177 doi:10.1016/s0169-4332(01)00325-7
Ma, Z.H., Tan, K.L., Chua, W.S., Kang, E.T., Neoh, K.G. (2001) Evaporated copper on surface modified polyaniline films. Applied Surface Science, 173. 242-251 doi:10.1016/s0169-4332(00)00910-7
Zhu, Y.Q., Kang, E.T., Neoh, K.G., Chan, L., Lai, D.M.Y., Huan, A.C.H. (2004) Surface modification of SiLK® by graft copolymerization with 4-vinylpyridine for reduction in copper diffusion. Applied Surface Science, 225. 144-155 doi:10.1016/j.apsusc.2003.09.046
Chen, Yongjun, Kang, E.T, Neoh, K.G (2002) Electroless polymerization of aniline on platinum and palladium surfaces. Applied Surface Science, 185. 267-276 doi:10.1016/s0169-4332(01)00817-0
Yu, Z. J., Kang, E. T., Neoh, K. G. (2002) Electroless Plating of Copper on Poly(tetrafluoroethylene) Films Modified by Surface Graft Copolymerization and Quaternization. Journal of the Electrochemical Society, 149. doi:10.1149/1.1419184
Wang, X.C, Zheng, H.Y, Lim, G.C (2002) Laser induced copper electroless plating on polyimide with Q-switch Nd:YAG laser. Applied Surface Science, 200. 165-171 doi:10.1016/s0169-4332(02)00850-4
Wu, Shaoyu, Kang, E.T, Neoh, K.G (2001) Interaction of copper atoms with surface graft-copolymerized poly(tetrafluoroethylene) film: an in situ X-ray photoelectron spectroscopic study. Applied Surface Science, 174. 296-305 doi:10.1016/s0169-4332(01)00195-7
Yu, W. H., Kang, E. T., Neoh, K. G. (2002) Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Substrates Modified by Plasma Graft Polymerization of 4-Vinylpyridine. Journal of the Electrochemical Society, 149. doi:10.1149/1.1512915
Zhang, Yan, Tan, K. L., Yang, G. H., Kang, E. T., Neoh, K. G. (2001) Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole. Journal of the Electrochemical Society, 148. doi:10.1149/1.1387237
Yu, W. H., Zhang, Yan, Kang, E. T., Neoh, K. G., Wu, S. Y., Chow, Y. F. (2002) Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole. Journal of the Electrochemical Society, 149. doi:10.1149/1.1507785
Li, Liang, Yan, Guoping, Wu, Jiangyu, Yu, Xianghua, Guo, Qingzhong, Kang, Entang (2008) Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine. Applied Surface Science, 254. 7331-7335 doi:10.1016/j.apsusc.2008.05.327
 
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