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Li, Liang, Yan, Guoping, Wu, Jiangyu, Yu, Xianghua, Guo, Qingzhong, Kang, Entang (2008) Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine. Applied Surface Science, 254. 7331-7335 doi:10.1016/j.apsusc.2008.05.327

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Reference TypeJournal (article/letter/editorial)
TitleElectroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine
JournalApplied Surface Science
AuthorsLi, LiangAuthor
Yan, GuopingAuthor
Wu, JiangyuAuthor
Yu, XianghuaAuthor
Guo, QingzhongAuthor
Kang, EntangAuthor
Year2008 (September)Volume254
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2008.05.327Search in ResearchGate
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Mindat Ref. ID9911740Long-form Identifiermindat:1:5:9911740:5
GUID0
Full ReferenceLi, Liang, Yan, Guoping, Wu, Jiangyu, Yu, Xianghua, Guo, Qingzhong, Kang, Entang (2008) Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine. Applied Surface Science, 254. 7331-7335 doi:10.1016/j.apsusc.2008.05.327
Plain TextLi, Liang, Yan, Guoping, Wu, Jiangyu, Yu, Xianghua, Guo, Qingzhong, Kang, Entang (2008) Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine. Applied Surface Science, 254. 7331-7335 doi:10.1016/j.apsusc.2008.05.327
In(n.d.) Applied Surface Science Vol. 254. Elsevier BV

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Li, Liang, Yan, Guoping, Cheng, Zhiyu, Wu, Jiangyu, Yu, Xianghua, Guo, Qingzhong (2009) Electroless plating of copper on Si(100) surfaces modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine. Surface and Interface Analysis, 41 (1). 69-74 doi:10.1002/sia.2994
Wang, W.C., Kang, E.T., Neoh, K.G. (2002) Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science, 199. 52-66 doi:10.1016/s0169-4332(02)00473-7
CHEN, YIWANG, SUN, WEI, DENG, QILAN, CHEN, LIE, HE, XIAOHUI (2007) ELECTROLESS PLATING OF COPPER ON POLYTETRAFLUOROETHYLENE FILMS MODIFIED BY SURFACE-INITIATED FREE RADICAL POLYMERIZATION OF 4-VINYLPYRIDINE. Surface Review and Letters, 14 (2). 241-253 doi:10.1142/s0218625x07009323
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Chen, Dongsheng, Li, Yi, Lu, Qinghua, Yin, Jie, Zhu, Zikang (2005) Selective silver seeding on laser modified polyimide for electroless copper plating. Applied Surface Science, 246. 167-173 doi:10.1016/j.apsusc.2004.11.005
Su, Wei, Yao, Libei, Yang, Fang, Li, Peiyuan, Chen, Juan, Liang, Lifang (2011) Electroless plating of copper on surface-modified glass substrate. Applied Surface Science, 257. 8067-8071 doi:10.1016/j.apsusc.2011.04.100
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Yu, W. H., Kang, E. T., Neoh, K. G. (2002) Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Substrates Modified by Plasma Graft Polymerization of 4-Vinylpyridine. Journal of the Electrochemical Society, 149. doi:10.1149/1.1512915
 
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