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Su, Wei, Yao, Libei, Yang, Fang, Li, Peiyuan, Chen, Juan, Liang, Lifang (2011) Electroless plating of copper on surface-modified glass substrate. Applied Surface Science, 257. 8067-8071 doi:10.1016/j.apsusc.2011.04.100

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Reference TypeJournal (article/letter/editorial)
TitleElectroless plating of copper on surface-modified glass substrate
JournalApplied Surface Science
AuthorsSu, WeiAuthor
Yao, LibeiAuthor
Yang, FangAuthor
Li, PeiyuanAuthor
Chen, JuanAuthor
Liang, LifangAuthor
Year2011 (July)Volume257
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2011.04.100Search in ResearchGate
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Mindat Ref. ID9916277Long-form Identifiermindat:1:5:9916277:9
GUID0
Full ReferenceSu, Wei, Yao, Libei, Yang, Fang, Li, Peiyuan, Chen, Juan, Liang, Lifang (2011) Electroless plating of copper on surface-modified glass substrate. Applied Surface Science, 257. 8067-8071 doi:10.1016/j.apsusc.2011.04.100
Plain TextSu, Wei, Yao, Libei, Yang, Fang, Li, Peiyuan, Chen, Juan, Liang, Lifang (2011) Electroless plating of copper on surface-modified glass substrate. Applied Surface Science, 257. 8067-8071 doi:10.1016/j.apsusc.2011.04.100
In(n.d.) Applied Surface Science Vol. 257. Elsevier BV

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