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Hwang, Chi-Won, Suganuma, Katsuaki (2004) Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering: A, 373. 187-194 doi:10.1016/j.msea.2004.01.019

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Reference TypeJournal (article/letter/editorial)
TitleJoint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates
JournalMaterials Science and Engineering: A
AuthorsHwang, Chi-WonAuthor
Suganuma, KatsuakiAuthor
Year2004 (May)Volume373
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2004.01.019Search in ResearchGate
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Mindat Ref. ID10031285Long-form Identifiermindat:1:5:10031285:4
GUID0
Full ReferenceHwang, Chi-Won, Suganuma, Katsuaki (2004) Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering: A, 373. 187-194 doi:10.1016/j.msea.2004.01.019
Plain TextHwang, Chi-Won, Suganuma, Katsuaki (2004) Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering: A, 373. 187-194 doi:10.1016/j.msea.2004.01.019
In(n.d.) Materials Science and Engineering: A Vol. 373. Elsevier BV

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Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Satyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
Hwang, Chi-Won, Suganuma, Katsuaki, Kiso, Masayuki, Hashimoto, Shigeo (2003) Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders. Journal of Materials Research, 18 (11) 2540-2543 doi:10.1557/jmr.2003.0354
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. Journal of Alloys and Compounds, 392. 247-252 doi:10.1016/j.jallcom.2004.09.045
Yoon, Jeong-Won, Jung, Seung-Boo (2007) Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging. Materials Science and Engineering: A, 452. 46-54 doi:10.1016/j.msea.2006.10.163
Esfandyarpour, M.J., Mahmudi, R. (2011) Microstructure and tensile behavior of Sn–5Sb lead-free solder alloy containing Bi and Cu. Materials Science and Engineering: A, 530. 402-410 doi:10.1016/j.msea.2011.09.103
Luef, Christoph, Flandorfer, Hans, Ipser, Herbert (2004) Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems. Zeitschrift für Metallkunde, 95. 151-163 doi:10.3139/146.017929
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko (2007) Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge. Key Engineering Materials, 353. 2033-2036 doi:10.4028/www.scientific.net/kem.353-358.2033
Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki (2017) Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls. Journal of Materials Science, 52. 3244-3254 doi:10.1007/s10853-016-0613-1
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints. Materials Science and Engineering: A, 483. 731-734 doi:10.1016/j.msea.2006.09.162
Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
 
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