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Satyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265

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Reference TypeJournal (article/letter/editorial)
TitleSolder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses
JournalMaterials Science Forum
AuthorsSatyanarayan, Author
Prabhu, K.N.Author
Year2015 (September)Volume830
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.830-831.265Search in ResearchGate
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Mindat Ref. ID9884073Long-form Identifiermindat:1:5:9884073:7
GUID0
Full ReferenceSatyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
Plain TextSatyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
In(2015) Materials Science Forum Vol. 830. Trans Tech Publications, Ltd.

See Also

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Satyanarayan, , Prabhu, K N (2013) Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses. Materials Science and Technology, 29. 1430-1440 doi:10.1179/1743284713y.0000000287
Satyanarayan, , Prabhu, K.N. (2012) Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates. Materials Science Forum, 710. 569-574 doi:10.4028/www.scientific.net/msf.710.569
Tikale, Sanjay, Sona, Mrunali, Prabhu, K.N. (2015) Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate. Materials Science Forum, 830. 215-218 doi:10.4028/www.scientific.net/msf.830-831.215
Sona, Mrunali, Narayan Prabhu, K. (2015) Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time. Materials Science Forum, 830. 286-289 doi:10.4028/www.scientific.net/msf.830-831.286
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering: A, 373. 187-194 doi:10.1016/j.msea.2004.01.019
Chen, Guohai, Ma, Ju Sheng, Geng, Zhi Ting (2005) Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy. Materials Science Forum, 475. 1747-1750 doi:10.4028/www.scientific.net/msf.475-479.1747
Wang, Feng Jiang, Ma, Xin, Qian, Yiyu (2005) Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint. Materials Science Forum, 502. 399-404 doi:10.4028/www.scientific.net/msf.502.399
Zbrzezny, A.R. (2002) Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds. Microscopy and Microanalysis, 8. 1456-1457 doi:10.1017/s1431927602107719
Satyanarayan, , Prabhu, K N (2011) Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates. Materials Science and Technology, 27. 1157-1162 doi:10.1179/026708310x12815992418337
Ventura, Tina, Cho, Young Hee, Dahle, Arne K. (2010) Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System. Materials Science Forum, 654. 1381-1384 doi:10.4028/www.scientific.net/msf.654-656.1381
Hirose, Akio, Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, Kobayashi, Kojiro F. (2006) Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization. Materials Science Forum, 512. 355-360 doi:10.4028/www.scientific.net/msf.512.355
 
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